Reliable Smart Molded Structures

Abstract

IMSE (Injection Molded Structural Electronics) solutions are made by integrating and encapsulating printed electronics and standard electronic components within durable 3D injection-molded plastics. Part of the technology development is to ensure that electric components and materials, such as polymer substrates, functional inks, and surface mounting adhesives, form a reliable solution. The technology verification includes stringent reliability testing. The used tests are rapid change of temperature, high temperature ageing and steady-state temperature-humidity. Here we present an additional testing case: 3000 cycles of thermal cycling ($- 30^{\circ}\mathrm{C}\dots$. $80^{\circ}\mathrm{C})$.