Bandgap engineering technology for suppressing the substrate-floating-effect in 0.15 /spl mu/m SOI-MOSFETs

M. Yoshimi, A. Nishiyama, M. Terauchi, O. Arisumi, A. Murakoshi, Y. Ushiku, S. Takeno, K. Suzuki
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引用次数: 1

Abstract

The substrate floating effect is the most fundamental problem in SOI-MOSFETs. Conventional countermeasures, such as body-contact, LDD structure are accompanied by area penalty, Id degradation and other drawbacks. To suppress this effect, we have proposed the bandgap engineering method, in which a narrow bandgap material is formed in the source region. In this paper, an ideal structure for the bandgap engineering is discussed and actually achievable performance is estimated based on simulations and experiments for 0.15 /spl mu/m SOI-MOSFETs.
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抑制0.15 /spl mu/m soi - mosfet衬底浮子效应的带隙工程技术
衬底浮动效应是soi - mosfet中最基本的问题。传统的对抗措施,如身体接触,LDD结构,伴随着区域罚分,Id退化和其他缺点。为了抑制这种影响,我们提出了带隙工程方法,即在源区形成窄带隙材料。本文讨论了一种理想的带隙工程结构,并根据0.15 /spl mu/m soi - mosfet的仿真和实验估计了实际可实现的性能。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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