Automatically form batch via real time dispatcher for furnace operation in 300 mm fab

De-Lung Wu, Hsi-Lo Lo, Cheng-Chung Pan, Yu-Ting Chang, Chin-Lang Peng
{"title":"Automatically form batch via real time dispatcher for furnace operation in 300 mm fab","authors":"De-Lung Wu, Hsi-Lo Lo, Cheng-Chung Pan, Yu-Ting Chang, Chin-Lang Peng","doi":"10.1109/SMTW.2004.1393707","DOIUrl":null,"url":null,"abstract":"Nowadays, the automation is the fundamental element of a 300 mm Fab. FOUP transportation, lot dispatching and data processing and other production requirements are integrated by the system. On the other hand, dispatching is getting more and more important due to the complicated process routing and reentry process flow in semiconductor Fab. It is important to optimize the batching size in furnace area, since most of furnace EQP are designed to accommodate up to 100 wafers in 300 mm Fab. In order to fully utilize the furnace, some waiting time is allowed to maximize the batch size. Beside, the furnace dispatching must consider the other issue, such as queue time limit. The pre-clean start time or form batch time must be well controlled to prevent product from queue time over and to keep machine from idle. This work describes an auto forming batch system for furnace operation, which is implemented in the real time dispatching system of PSC FAB 12A. The auto form batch rate is raised up to 85% form Q3 2003 to now. And finally, it has been proved that the auto form batch dispatching system not only improve furnace utilization but also reduces the cycle time between wet and furnace operation. Headings of This work are as follows: (1) introduction, (2) RTD system structure for furnace batch dispatching, (3) batch forming time model and furnace dispatching, (4) result and discussion, and (5) future direction and conclusion.","PeriodicalId":369092,"journal":{"name":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","volume":"25 4 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-09-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2004 Semiconductor Manufacturing Technology Workshop Proceedings (IEEE Cat. No.04EX846)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SMTW.2004.1393707","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4

Abstract

Nowadays, the automation is the fundamental element of a 300 mm Fab. FOUP transportation, lot dispatching and data processing and other production requirements are integrated by the system. On the other hand, dispatching is getting more and more important due to the complicated process routing and reentry process flow in semiconductor Fab. It is important to optimize the batching size in furnace area, since most of furnace EQP are designed to accommodate up to 100 wafers in 300 mm Fab. In order to fully utilize the furnace, some waiting time is allowed to maximize the batch size. Beside, the furnace dispatching must consider the other issue, such as queue time limit. The pre-clean start time or form batch time must be well controlled to prevent product from queue time over and to keep machine from idle. This work describes an auto forming batch system for furnace operation, which is implemented in the real time dispatching system of PSC FAB 12A. The auto form batch rate is raised up to 85% form Q3 2003 to now. And finally, it has been proved that the auto form batch dispatching system not only improve furnace utilization but also reduces the cycle time between wet and furnace operation. Headings of This work are as follows: (1) introduction, (2) RTD system structure for furnace batch dispatching, (3) batch forming time model and furnace dispatching, (4) result and discussion, and (5) future direction and conclusion.
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通过实时调度器自动形成批量,用于300mm工厂的炉操作
如今,自动化是300mm晶圆厂的基本要素。FOUP运输、批量调度和数据处理等生产需求由系统集成。另一方面,由于半导体晶圆厂复杂的工艺路线和返工流程,调度变得越来越重要。优化炉面积的配料尺寸是很重要的,因为大多数炉EQP设计为在300毫米Fab中容纳多达100片晶圆。为了充分利用炉子,允许一些等待时间,以最大限度地提高批次大小。此外,加热炉调度还必须考虑排队时间限制等问题。必须控制好预清洁开始时间或成型批时间,以防止产品超时排队,防止机器闲置。本文介绍了在PSC FAB 12A实时调度系统中实现的炉膛自动成型批量系统。自2003年第三季度至今,自动成批率提高到85%。实践证明,该自动成型批量调度系统不仅提高了炉膛利用率,而且缩短了湿法与加热炉之间的循环时间。本工作的标题如下:(1)绪论;(2)炉批调度RTD系统结构;(3)炉批成型时间模型与炉调度;(4)结果与讨论;(5)未来方向与结论。
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