Influence of gate-source/drain overlap on FeFETs

IF 1.4 4区 物理与天体物理 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Solid-state Electronics Pub Date : 2024-01-26 DOI:10.1016/j.sse.2024.108862
Changha Kim , Dong-Oh Kim , Woo Young Choi
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Abstract

The influences of gate-source/drain overlap on ferroelectric field-effect transistors (FeFETs) are investigated with various gate-source/drain overlap lengths (Lov’s) and doping concentrations of the gate-source/drain overlap region (Dov’s). In contrast to conventional metal-ferroelectric-insulator-semiconductor (MFIS) FeFETs, a metal layer between a ferroelectric and an insulator layer allows overlap capacitance to affect the entire ferroelectric layer in metal-ferroelectric-metal–insulator-semiconductor (MFMIS) FeFETs. As Lov and Dov increase, the effective channel length of both FeFETs decreases. In the case of MFMIS FeFETs, the gate-to-source/drain overlap capacitance (Cov,gate-S/D) increases, leading to a larger voltage drop across the ferroelectric layer. According to the simulation results, MFMIS FeFETs show a wider memory window (MW) and larger sensing margin than MFIS FeFETs.

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栅源/漏极重叠对 FeFET 的影响
本研究采用不同的栅源/漏极重叠长度(Lov's)和栅源/漏极重叠区的掺杂浓度(Dov's),研究了栅源/漏极重叠对铁电场效应晶体管(FeFET)的影响。与传统的金属-铁电-绝缘体-半导体 (MFIS) FeFET 不同,铁电层和绝缘体层之间的金属层允许重叠电容影响金属-铁电-金属-绝缘体-半导体 (MFMIS) FeFET 中的整个铁电层。随着 Lov 和 Dov 的增加,这两种 FeFET 的有效沟道长度都会减小。对于 MFMIS FeFET,栅极到源极/漏极的重叠电容(Cov,gate-S/D)会增加,导致铁电层上的压降增大。根据仿真结果,与 MFIS FeFET 相比,MFMIS FeFET 具有更宽的存储窗口 (MW) 和更大的传感裕度。
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来源期刊
Solid-state Electronics
Solid-state Electronics 物理-工程:电子与电气
CiteScore
3.00
自引率
5.90%
发文量
212
审稿时长
3 months
期刊介绍: It is the aim of this journal to bring together in one publication outstanding papers reporting new and original work in the following areas: (1) applications of solid-state physics and technology to electronics and optoelectronics, including theory and device design; (2) optical, electrical, morphological characterization techniques and parameter extraction of devices; (3) fabrication of semiconductor devices, and also device-related materials growth, measurement and evaluation; (4) the physics and modeling of submicron and nanoscale microelectronic and optoelectronic devices, including processing, measurement, and performance evaluation; (5) applications of numerical methods to the modeling and simulation of solid-state devices and processes; and (6) nanoscale electronic and optoelectronic devices, photovoltaics, sensors, and MEMS based on semiconductor and alternative electronic materials; (7) synthesis and electrooptical properties of materials for novel devices.
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