Investigation of Dual-Channel Compensating Plasma Diode for Reconfigurable Antenna

Q4 Engineering Russian Microelectronics Pub Date : 2024-06-04 DOI:10.1134/s1063739723600917
Yingying Wang, Yutian Li, Zhanrong Zhou, Xiaofang Shen, Chao Ma, Yang Gao, Yiming Chen
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Abstract

This study delves into the radiation properties of a reconfigurable antenna that integrates both traditional single-channel SPiN diodes and dual-channel compensating SPiN diodes as core elements. The dual-channel SPiN diode compensates for the attenuation of carrier concentration at the midpoint of the intrinsic region, resulting in a carrier concentration exceeding 1018 cm–3. The aim is to explore novel configurations of solid-state plasma antennas that have the potential to significantly improve radiation performance. The reconfigurable antenna is capable of operating in two distinct modes, specifically a low-frequency mode and a high-frequency mode, depending on the conducting state of the diode array. Through graphical analysis, it was observed that two reconfigured modes were successfully achieved, with relative bandwidths exceeding 13%. The incorporation of dual-channel compensating SPiN diodes led to notable performance improvements, as evident from a substantial reduction in the S11 parameter. These enhancements can be attributed to the intensified concentration and more uniform distribution of the solid-state plasma achieved by the dual-channel compensating devices.

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用于可重构天线的双通道补偿等离子二极管研究
摘要 本研究深入探讨了一种可重构天线的辐射特性,该天线集成了传统的单通道 SPiN 二极管和双通道补偿 SPiN 二极管作为核心元件。双通道 SPiN 二极管可补偿本征区中点的载流子浓度衰减,从而使载流子浓度超过 1018 cm-3。目的是探索固态等离子体天线的新型配置,这些配置有可能显著提高辐射性能。根据二极管阵列的导电状态,可重构天线能够在两种不同的模式下工作,特别是低频模式和高频模式。通过图形分析,可以观察到成功实现了两种重新配置模式,相对带宽超过 13%。双通道补偿 SPiN 二极管的加入显著提高了性能,S11 参数的大幅降低就是证明。这些改进可归因于双通道补偿器件实现了固态等离子体的更高浓度和更均匀分布。
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来源期刊
Russian Microelectronics
Russian Microelectronics Materials Science-Materials Chemistry
CiteScore
0.70
自引率
0.00%
发文量
43
期刊介绍: Russian Microelectronics  covers physical, technological, and some VLSI and ULSI circuit-technical aspects of microelectronics and nanoelectronics; it informs the reader of new trends in submicron optical, x-ray, electron, and ion-beam lithography technology; dry processing techniques, etching, doping; and deposition and planarization technology. Significant space is devoted to problems arising in the application of proton, electron, and ion beams, plasma, etc. Consideration is given to new equipment, including cluster tools and control in situ and submicron CMOS, bipolar, and BICMOS technologies. The journal publishes papers addressing problems of molecular beam epitaxy and related processes; heterojunction devices and integrated circuits; the technology and devices of nanoelectronics; and the fabrication of nanometer scale devices, including new device structures, quantum-effect devices, and superconducting devices. The reader will find papers containing news of the diagnostics of surfaces and microelectronic structures, the modeling of technological processes and devices in micro- and nanoelectronics, including nanotransistors, and solid state qubits.
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