Memristors Modelling and Simulation for Digital to Analog Converter Circuit

Q4 Engineering Russian Microelectronics Pub Date : 2024-06-04 DOI:10.1134/s1063739723600723
Shaimaa Mostafa, Fathy Z. Amer, Mohamed M. ElKhatib, Roaa I. Mubarak
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Abstract

The thermometer digital-to-analog converter (DAC) is a distinctive architecture that plays a vital role in converting digital data into corresponding analog signals, the thermometer DAC employs a resistor network where each bit of the digital input corresponds to a unique resistor. It has notable drawbacks that need careful consideration. As the resolution of the DAC increases, the number of required current sources grows exponentially, leading to complex and demanding circuitry. This can escalate power consumption and occupy significant chip area, which is a critical concern in integrated circuit design. Furthermore, the current mismatch between the multiple current sources. Therefore, integrating memristors into DACs paves the way for more compact and efficient designs, reducing system complexity and enhancing reliability. The Voltage ThrEshold Adaptive Memristor (VTEAM) model of memristor is validated by using Virtuoso. In addition, a digital-to-analog converter based on memristor technology is implemented, taking advantage of the memristor’s compact size, minimal power usage, and a voltage threshold that is relatively low. The DAC design being proposed is based on a core DAC cell that consists of two memristors connected in opposing orientations.

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用于数模转换电路的晶体管建模与仿真
摘要 温度计数模转换器(DAC)是一种独特的结构,在将数字数据转换为相应的模拟信号方面发挥着重要作用。它有一些明显的缺点,需要仔细考虑。随着 DAC 分辨率的提高,所需的电流源数量呈指数增长,导致电路复杂且要求高。这会增加功耗,占用大量芯片面积,这是集成电路设计中的一个关键问题。此外,多个电流源之间的电流也不匹配。因此,将忆阻器集成到 DAC 中为更紧凑、更高效的设计、降低系统复杂性和提高可靠性铺平了道路。利用 Virtuoso 验证了忆阻器的电压阈值自适应忆阻器(VTEAM)模型。此外,还利用忆阻器体积小、功耗低和电压阈值相对较低的优势,实现了基于忆阻器技术的数模转换器。所提出的数模转换器设计基于一个核心数模转换器单元,该单元由两个以相反方向连接的忆阻器组成。
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来源期刊
Russian Microelectronics
Russian Microelectronics Materials Science-Materials Chemistry
CiteScore
0.70
自引率
0.00%
发文量
43
期刊介绍: Russian Microelectronics  covers physical, technological, and some VLSI and ULSI circuit-technical aspects of microelectronics and nanoelectronics; it informs the reader of new trends in submicron optical, x-ray, electron, and ion-beam lithography technology; dry processing techniques, etching, doping; and deposition and planarization technology. Significant space is devoted to problems arising in the application of proton, electron, and ion beams, plasma, etc. Consideration is given to new equipment, including cluster tools and control in situ and submicron CMOS, bipolar, and BICMOS technologies. The journal publishes papers addressing problems of molecular beam epitaxy and related processes; heterojunction devices and integrated circuits; the technology and devices of nanoelectronics; and the fabrication of nanometer scale devices, including new device structures, quantum-effect devices, and superconducting devices. The reader will find papers containing news of the diagnostics of surfaces and microelectronic structures, the modeling of technological processes and devices in micro- and nanoelectronics, including nanotransistors, and solid state qubits.
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