Plasma Profiling of LiNbO3 Film for the Formation of Piezoelectric Energy Converters

Q4 Engineering Russian Microelectronics Pub Date : 2024-06-04 DOI:10.1134/s1063739724700793
V. S. Klimin, A. Geldash, O. A. Ageev
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Abstract

The presented work shows the formation and profiling of nanocrystalline LiNbO3 films obtained by pulsed laser deposition, as well as the influence of the laser pulse repetition rate on the electrical properties, morphology, and growth processes of granular films. The study revealed that the nucleation process in LiNbO3 films can be intentionally altered by increasing the laser pulse repetition rate. When the repetition rate was set to 4 Hz, the resulting film comprised local islands and clusters with a diameter of 118.1 ± 5.9 nm. On the other hand, nanocrystalline films grown at a repetition rate of 10 Hz exhibited a continuous granular structure with a grain diameter of 235 ± 11.75 nm. These findings have the potential to contribute to the advancement of environmentally friendly energy devices utilizing lead-free piezoelectric energy harvesters.

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用于形成压电能量转换器的 LiNbO3 薄膜的等离子体轮廓分析
摘要 本文展示了通过脉冲激光沉积获得的纳米晶 LiNbO3 薄膜的形成和剖面,以及激光脉冲重复率对颗粒状薄膜的电性能、形貌和生长过程的影响。研究发现,可以通过提高激光脉冲重复率来有意改变氧化铌锂薄膜的成核过程。当重复率设定为 4 Hz 时,生成的薄膜由直径为 118.1 ± 5.9 nm 的局部岛屿和簇组成。另一方面,在重复频率为 10 Hz 时生长的纳米晶体薄膜呈现出连续的粒状结构,晶粒直径为 235 ± 11.75 nm。这些发现有望促进利用无铅压电能量收集器的环境友好型能源设备的发展。
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来源期刊
Russian Microelectronics
Russian Microelectronics Materials Science-Materials Chemistry
CiteScore
0.70
自引率
0.00%
发文量
43
期刊介绍: Russian Microelectronics  covers physical, technological, and some VLSI and ULSI circuit-technical aspects of microelectronics and nanoelectronics; it informs the reader of new trends in submicron optical, x-ray, electron, and ion-beam lithography technology; dry processing techniques, etching, doping; and deposition and planarization technology. Significant space is devoted to problems arising in the application of proton, electron, and ion beams, plasma, etc. Consideration is given to new equipment, including cluster tools and control in situ and submicron CMOS, bipolar, and BICMOS technologies. The journal publishes papers addressing problems of molecular beam epitaxy and related processes; heterojunction devices and integrated circuits; the technology and devices of nanoelectronics; and the fabrication of nanometer scale devices, including new device structures, quantum-effect devices, and superconducting devices. The reader will find papers containing news of the diagnostics of surfaces and microelectronic structures, the modeling of technological processes and devices in micro- and nanoelectronics, including nanotransistors, and solid state qubits.
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