Fabien Chevreux, Manon Letiche, Alexey Vorobiev, Max Wolff, Laurent-Luc Chapelon
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引用次数: 0
Abstract
The uptake of water of as-deposited thin films of SiOxNy and SiOx hard coatings on epoxy polymer resin by PECVD is studied by X-ray photoelectron spectroscopy (XPS) and ToF-SIMS. The absence of a chemical composition gradient at the dielectric-resin interface suggests a rough interface between the two materials. Upon storage in a cleanroom environment for 6 months (19 °C/40% RH), the uptake of water of the polymer resin layer was observed by XPS. Additionally, ToF-SIMS depth profiling revealed significant changes in the water content at the SiOxNy-resin interface. We attribute these changes to the absorption of water diffusing through the dielectric-resin. Neutron reflectometry performed under a dry and D2O atmosphere confirms that D2O was nonreversibly absorbed in the SiOxNy-resin, but only limited moisture diffusion was observed in the SiOx-resin.
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