{"title":"Optimization of soft magnetic properties of Fe–Si–B–Cu–C alloys by modulation of Fe/B content and annealing process","authors":"Ruichen Shi, Peixin Fu, Yuyang Zhang, Zihao Huang, Jingtao Qi, Shunxing Liang, Pingjun Tao, Yuanzheng Yang","doi":"10.1007/s10854-024-13253-5","DOIUrl":null,"url":null,"abstract":"<div><p>For Fe-based amorphous/nanocrystalline alloys, how to meet the high Fe content with strong amorphous formation capability has become a serious challenge. In this paper, the purpose of higher saturation magnetic induction strength is achieved by changing the B content. The effects of Fe content, different annealing processes on the phase structure of Fe<sub>80+<i>x</i></sub>Si<sub>2</sub>B<sub>17−<i>x</i></sub>Cu<sub>0.5</sub>C<sub>0.5</sub> (<i>x</i> = 0, 1, 2, 3, 4) amorphous and nanocrystalline alloys have been systematically investigated by means of XRD, DSC and VSM methods, thermal stability and soft magnetic properties. The results show that the alloys still have the ability to form a single amorphous phase when Fe content reaches 83%. In terms of the thermal stability of the alloy, the increase of Fe content facilitates the obtaining of a larger crystallization temperature interval, which is beneficial to the heat treatment process and the preparation of amorphous/nanocrystalline soft magnetic materials. Comparison of the one-step annealing and two-step annealing processes reveals that the two-step annealing process results in smaller average grain size and smaller coercivity. The heat treatment of the two-step annealing process for different time reveals that holding at 335 °C for 10 min and then increasing to 410 °C for 10 min could modulate the excellent soft magnetic properties with a saturation magnetization (<i>M</i><sub>s</sub>) of 205.7 emu/g and coercivity of 14.9 A/m.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":null,"pages":null},"PeriodicalIF":2.8000,"publicationDate":"2024-08-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-024-13253-5","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
For Fe-based amorphous/nanocrystalline alloys, how to meet the high Fe content with strong amorphous formation capability has become a serious challenge. In this paper, the purpose of higher saturation magnetic induction strength is achieved by changing the B content. The effects of Fe content, different annealing processes on the phase structure of Fe80+xSi2B17−xCu0.5C0.5 (x = 0, 1, 2, 3, 4) amorphous and nanocrystalline alloys have been systematically investigated by means of XRD, DSC and VSM methods, thermal stability and soft magnetic properties. The results show that the alloys still have the ability to form a single amorphous phase when Fe content reaches 83%. In terms of the thermal stability of the alloy, the increase of Fe content facilitates the obtaining of a larger crystallization temperature interval, which is beneficial to the heat treatment process and the preparation of amorphous/nanocrystalline soft magnetic materials. Comparison of the one-step annealing and two-step annealing processes reveals that the two-step annealing process results in smaller average grain size and smaller coercivity. The heat treatment of the two-step annealing process for different time reveals that holding at 335 °C for 10 min and then increasing to 410 °C for 10 min could modulate the excellent soft magnetic properties with a saturation magnetization (Ms) of 205.7 emu/g and coercivity of 14.9 A/m.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.