Fault-tolerant routing for reliable packet transmission in on-chip networks

IF 1.9 3区 工程技术 Q3 ENGINEERING, ELECTRICAL & ELECTRONIC Microelectronics Journal Pub Date : 2024-09-28 DOI:10.1016/j.mejo.2024.106425
Yiming Ouyang , Tianbao Zhang , Jianhua Li , Huaguo Liang
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Abstract

In deep submicron technology, integrated circuits are susceptible to various factors, leading to increased probabilities of chip failures. The routers within NoC, connecting processor cores, also experience elevated fault rates, thereby impacting normal communication between processors. Therefore, implementing fault-tolerant mechanisms in on-chip networks becomes particularly crucial. In this paper, we propose a fault-tolerant routing scheme to ensure the accurate transmission, injection, and ejection of packets, even in the event of router failures at any node in the NoC. We have enhanced the router architecture by integrating bypass controllers (BCs) to connect east–west and north–south links, and linking these BCs to the local. This modification enables uninterrupted communication between cores. Based on this architecture, we propose a straightforward routing algorithm aimed at minimizing detours and ensuring packet transmission along the shortest path , thus reducing transmission latency. Experimental results demonstrate that our proposed fault-tolerant scheme significantly enhances reliability under scenarios involving multiple faulty routers when compared to existing schemes.
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芯片网络中可靠数据包传输的容错路由选择
在深亚微米技术中,集成电路容易受到各种因素的影响,导致芯片故障概率增加。NoC 中连接处理器内核的路由器也会出现故障,从而影响处理器之间的正常通信。因此,在片上网络中实施容错机制变得尤为重要。在本文中,我们提出了一种容错路由方案,即使 NoC 中任何节点的路由器发生故障,也能确保数据包的准确传输、注入和剔除。我们通过集成旁路控制器(BC)来连接东西向和南北向链路,并将这些 BC 连接到本地,从而增强了路由器架构。这一修改实现了内核之间的不间断通信。在此架构基础上,我们提出了一种直接的路由算法,旨在最大限度地减少迂回,确保数据包沿最短路径传输,从而减少传输延迟。实验结果表明,与现有方案相比,我们提出的容错方案在涉及多个故障路由器的情况下大大提高了可靠性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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来源期刊
Microelectronics Journal
Microelectronics Journal 工程技术-工程:电子与电气
CiteScore
4.00
自引率
27.30%
发文量
222
审稿时长
43 days
期刊介绍: Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems. The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc. Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.
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