Zhengfeng Huang , Xin Chen , Xinyu Jiang , Lei Ai , Huaguo Liang , Yiming Ouyang , Tianming Ni
{"title":"Design of radiation hardened latch with low delay and tolerance of quadruple-node-upset in 32 nm process","authors":"Zhengfeng Huang , Xin Chen , Xinyu Jiang , Lei Ai , Huaguo Liang , Yiming Ouyang , Tianming Ni","doi":"10.1016/j.mejo.2024.106428","DOIUrl":null,"url":null,"abstract":"<div><div>As integrated circuit technology continues to shrink, single-event multiple-node-upset induced by charge sharing effect has become an important factor affecting chip reliability. This paper proposes two quadruple-node-upset hardened latches: 4DICE-C and 4DICE-V. These two latches are both based on dual-interlocked-storage-cell (DICE) that can achieve single-node-upset self-recovery. Besides, a quadruple-modular redundancy fault-tolerant mechanism is constructed. The 4DICE-C uses the clocked quadruple-input C-element at the output stage, the 4DICE-V uses clocked voter at the output stage. Compared with previous hardened latches containing C-elements, the 4DICE-V is less sensitive to high impedance state and can efficiently tolerate soft errors at internal nodes. In addition, compared with previous single-event triple-node-upset and quadruple-node-upset hardened latches, the 4DICE-C latch has achieved 100 % tolerance efficiency of single-event quadruple-node-upset, the best delay overhead and APDP comprehensive overhead, 18.69 % lower than average delay.</div></div>","PeriodicalId":49818,"journal":{"name":"Microelectronics Journal","volume":null,"pages":null},"PeriodicalIF":1.9000,"publicationDate":"2024-09-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Microelectronics Journal","FirstCategoryId":"5","ListUrlMain":"https://www.sciencedirect.com/science/article/pii/S1879239124001322","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q3","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
As integrated circuit technology continues to shrink, single-event multiple-node-upset induced by charge sharing effect has become an important factor affecting chip reliability. This paper proposes two quadruple-node-upset hardened latches: 4DICE-C and 4DICE-V. These two latches are both based on dual-interlocked-storage-cell (DICE) that can achieve single-node-upset self-recovery. Besides, a quadruple-modular redundancy fault-tolerant mechanism is constructed. The 4DICE-C uses the clocked quadruple-input C-element at the output stage, the 4DICE-V uses clocked voter at the output stage. Compared with previous hardened latches containing C-elements, the 4DICE-V is less sensitive to high impedance state and can efficiently tolerate soft errors at internal nodes. In addition, compared with previous single-event triple-node-upset and quadruple-node-upset hardened latches, the 4DICE-C latch has achieved 100 % tolerance efficiency of single-event quadruple-node-upset, the best delay overhead and APDP comprehensive overhead, 18.69 % lower than average delay.
期刊介绍:
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.
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