Lamiaa G. Alharbe, M. Yasir Ali, Rasmiah S. Almufarij, Islam Ragab, Eddie Gazo-Hanna, Salhah Hamed Alrefaee, Mohamed Abdelsabour Fahmy, Romulo R. Macadangdang Jr., M. Musa Saad H.-E., Adnan Ali, Arslan Ashfaq
{"title":"Enhanced thermoelectric power factor in BiSnTe alloy thin films via post-annealing: a structural and electrical study","authors":"Lamiaa G. Alharbe, M. Yasir Ali, Rasmiah S. Almufarij, Islam Ragab, Eddie Gazo-Hanna, Salhah Hamed Alrefaee, Mohamed Abdelsabour Fahmy, Romulo R. Macadangdang Jr., M. Musa Saad H.-E., Adnan Ali, Arslan Ashfaq","doi":"10.1007/s10854-024-13791-y","DOIUrl":null,"url":null,"abstract":"<div><p>This study investigates the impact of post-annealing time duration on the structural, electrical, and thermoelectric properties of BiSnTe alloy thin films grown using a simple thermal evaporation route. X-ray diffraction (XRD) analysis revealed that grown samples exhibited a cubic rock-salt structure, with enhanced crystallinity and increased lattice parameters as post-annealing time extended from 1 to 4 h. Raman spectroscopy indicated shifts in vibrational modes toward lower wavelengths, attributed to the redistribution of Bi atoms within the SnTe matrix during annealing. Scanning electron microscopy (SEM) demonstrated uniform surface morphology with grain growth corresponding to longer annealing times. Electrical measurements showed a decrease in charge carrier concentration from 7.62 × 10<sup>19</sup> cm<sup>−3</sup> to 6.34 × 10<sup>19</sup> cm<sup>−3</sup> and a reduction in mobility from 202.21 cm<sup>2</sup>V<sup>−1</sup> s<sup>−1</sup> to 126.89 cm<sup>2</sup>V<sup>−1</sup> s<sup>−1</sup>. This was correlated with grain growth, defect formation, and strain relaxation. The Seebeck coefficient increased the as-grown BiSnTe alloy thin film to 4 h post-annealed sample from 13.30 to 81.3 mV/K due to the reduction of carrier concentration with increasing the post-annealing duration. The corresponding thermoelectric power factor reached 1461 µWm<sup>−1</sup> K<sup>−2</sup>, demonstrating the material's potential for thermoelectric applications.</p></div>","PeriodicalId":646,"journal":{"name":"Journal of Materials Science: Materials in Electronics","volume":"35 31","pages":""},"PeriodicalIF":2.8000,"publicationDate":"2024-11-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of Materials Science: Materials in Electronics","FirstCategoryId":"5","ListUrlMain":"https://link.springer.com/article/10.1007/s10854-024-13791-y","RegionNum":4,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"ENGINEERING, ELECTRICAL & ELECTRONIC","Score":null,"Total":0}
引用次数: 0
Abstract
This study investigates the impact of post-annealing time duration on the structural, electrical, and thermoelectric properties of BiSnTe alloy thin films grown using a simple thermal evaporation route. X-ray diffraction (XRD) analysis revealed that grown samples exhibited a cubic rock-salt structure, with enhanced crystallinity and increased lattice parameters as post-annealing time extended from 1 to 4 h. Raman spectroscopy indicated shifts in vibrational modes toward lower wavelengths, attributed to the redistribution of Bi atoms within the SnTe matrix during annealing. Scanning electron microscopy (SEM) demonstrated uniform surface morphology with grain growth corresponding to longer annealing times. Electrical measurements showed a decrease in charge carrier concentration from 7.62 × 1019 cm−3 to 6.34 × 1019 cm−3 and a reduction in mobility from 202.21 cm2V−1 s−1 to 126.89 cm2V−1 s−1. This was correlated with grain growth, defect formation, and strain relaxation. The Seebeck coefficient increased the as-grown BiSnTe alloy thin film to 4 h post-annealed sample from 13.30 to 81.3 mV/K due to the reduction of carrier concentration with increasing the post-annealing duration. The corresponding thermoelectric power factor reached 1461 µWm−1 K−2, demonstrating the material's potential for thermoelectric applications.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.