Enhanced thermoelectric power factor in BiSnTe alloy thin films via post-annealing: a structural and electrical study

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Materials Science: Materials in Electronics Pub Date : 2024-11-04 DOI:10.1007/s10854-024-13791-y
Lamiaa G. Alharbe, M. Yasir Ali, Rasmiah S. Almufarij, Islam Ragab, Eddie Gazo-Hanna, Salhah Hamed Alrefaee, Mohamed Abdelsabour Fahmy, Romulo R. Macadangdang Jr., M. Musa Saad H.-E., Adnan Ali, Arslan Ashfaq
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Abstract

This study investigates the impact of post-annealing time duration on the structural, electrical, and thermoelectric properties of BiSnTe alloy thin films grown using a simple thermal evaporation route. X-ray diffraction (XRD) analysis revealed that grown samples exhibited a cubic rock-salt structure, with enhanced crystallinity and increased lattice parameters as post-annealing time extended from 1 to 4 h. Raman spectroscopy indicated shifts in vibrational modes toward lower wavelengths, attributed to the redistribution of Bi atoms within the SnTe matrix during annealing. Scanning electron microscopy (SEM) demonstrated uniform surface morphology with grain growth corresponding to longer annealing times. Electrical measurements showed a decrease in charge carrier concentration from 7.62 × 1019 cm−3 to 6.34 × 1019 cm−3 and a reduction in mobility from 202.21 cm2V−1 s−1 to 126.89 cm2V−1 s−1. This was correlated with grain growth, defect formation, and strain relaxation. The Seebeck coefficient increased the as-grown BiSnTe alloy thin film to 4 h post-annealed sample from 13.30 to 81.3 mV/K due to the reduction of carrier concentration with increasing the post-annealing duration. The corresponding thermoelectric power factor reached 1461 µWm−1 K−2, demonstrating the material's potential for thermoelectric applications.

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通过后退火提高 BiSnTe 合金薄膜的热电功率因数:结构和电气研究
本研究探讨了退火后持续时间对采用简单热蒸发路线生长的碲镉铋合金薄膜的结构、电学和热电性能的影响。X 射线衍射(XRD)分析表明,生长的样品呈现立方盐岩结构,随着后退火时间从 1 小时延长到 4 小时,结晶度增强,晶格参数增加。扫描电子显微镜(SEM)显示出均匀的表面形态,退火时间越长,晶粒越大。电学测量显示,电荷载流子浓度从 7.62 × 1019 cm-3 降至 6.34 × 1019 cm-3,迁移率从 202.21 cm2V-1 s-1 降至 126.89 cm2V-1 s-1。这与晶粒生长、缺陷形成和应变松弛有关。由于载流子浓度随退火后持续时间的增加而降低,因此从生长前的 BiSnTe 合金薄膜到退火后 4 小时的样品,其塞贝克系数从 13.30 mV/K 增加到 81.3 mV/K。相应的热电功率因数达到 1461 µWm-1 K-2,证明了该材料在热电应用方面的潜力。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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