Jinhua Lao, Jianwen Chen, Dengyan Hu, Wenbo Zhu, Si Liu, Xiucai Wang, Shaopeng Zhou, Peng Xiao, Xinmei Yu, Zhongbin Pan
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引用次数: 0
Abstract
The utilization of multiple dielectric materials is an effective way to improve the energy storage performance of dielectric thin films. However, the heterointerfaces are the underbelly of multilayer dielectric thin films, which often causes defect-induced breakdown. The adaptive anodizing method was proposed to optimize dielectric heterointerface. The single anodization Al2O3/Ba0.5Sr0.5TiO3/Al2O3 (SAB) thin films were fabricated by anodizing Al/Ba0.5Sr0.5TiO3/Al thin films under the high electric field. The Al2O3/Ba0.5Sr0.5TiO3 abrupt interfaces had been optimized to become more compact, forming stable transition heterointerfaces. The SAB thin films exhibit excellent electric properties, including a breakdown strength of 580 MV m−1, an energy storage density of 16.4 J cm−3, and a leakage current density < 10–6 A cm−2 from 0 to 225 MV m−1. The finite element simulation was constructed to demonstrate the defect self-repair process under high electric field. This work offers a promising strategy to fabricate multilayer dielectric thin films with high breakdown strength and energy storage density.
期刊介绍:
The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.