High-throughput exploration of stable semiconductors using deep learning and density functional theory

IF 4.6 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Materials Science in Semiconductor Processing Pub Date : 2025-03-15 Epub Date: 2024-11-29 DOI:10.1016/j.mssp.2024.109150
Gege Min , Wenxu Wei , Qingyang Fan , Teng Wan , Ming Ye , Sining Yun
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Abstract

Semiconductors can lead to new applications and technological innovations. In this work, we developed a computational pipeline to discover new semiconductors by combining deep learning and high-throughput first-principles calculations. We used a random strategy combined with group and graph theory to generate initial boron nitride polymorphs and developed a classifier based on graph convolutional neural network to screen semiconductors and study their stability. We found 26 new stable boron nitride polymorphs in Pc phase, of which 3 are direct bandgap semiconductors, and 10 are quasi-direct bandgap semiconductors. This discovery not only expands the library of known semiconductor materials but also provides potential candidates for high-performance electronic and optoelectronic devices, paving the way for future technological advancements.

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利用深度学习和密度泛函理论探索稳定半导体的高通量
半导体可以带来新的应用和技术创新。在这项工作中,我们开发了一个计算管道,通过结合深度学习和高通量第一性原理计算来发现新的半导体。采用群论和图论相结合的随机策略生成初始氮化硼多晶,并开发了基于图卷积神经网络的分类器来筛选半导体并研究其稳定性。我们在Pc相中发现了26个新的稳定的氮化硼多晶,其中3个是直接带隙半导体,10个是准直接带隙半导体。这一发现不仅扩展了已知半导体材料的库,而且为高性能电子和光电子器件提供了潜在的候选材料,为未来的技术进步铺平了道路。
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来源期刊
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing 工程技术-材料科学:综合
CiteScore
8.00
自引率
4.90%
发文量
780
审稿时长
42 days
期刊介绍: Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
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