Controlled synthesis of Mn-doped ZnO nanoparticles for low-frequency Di-electric devices

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Materials Science: Materials in Electronics Pub Date : 2024-12-17 DOI:10.1007/s10854-024-14034-w
Muhammad Sajid, Abdur Raheem, Muhammad Mudasser, Sidra Shujah, Muhammad Adil, Muhammad Nouman Khan, Sufaid Shah
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Abstract

Transition metal oxide (TMOs) nanomaterials have gained remarkable attention due to their vast potential applications. In this study, a controlled facile synthesis route is applied for the preparation of manganese (Mn) doped ZnO nanoparticles (NPs) by varying Mn amount from 2 to 8%. X-ray diffractometry (XRD) analysis confirms a defect-free hexagonal wurtzite crystal structure. Transmission electron microscope (TEM) images reveal an increasing trend in the particle size from ~ 17 to ~ 34 nm with increasing Mn doping concentration. Similarly, UV–Vis spectroscopy shows an increase in the energy band gap from 2.91 to 3.33 eV with dopant concentrations. Electrical measurement confirms an increase in the dielectric constant which makes these materials efficient for low frequency devices.

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用于低频双电源器件的掺锰氧化锌纳米粒子的可控合成
过渡金属氧化物(TMOs)纳米材料因其广阔的应用前景而备受关注。在本研究中,采用可控的易合成路线制备了锰(Mn)掺杂ZnO纳米颗粒(NPs), Mn含量从2%到8%不等。x射线衍射(XRD)分析证实了无缺陷的六方纤锌矿晶体结构。透射电子显微镜(TEM)图像显示,随着Mn掺杂浓度的增加,颗粒尺寸从~ 17 nm增大到~ 34 nm。同样,紫外可见光谱显示,随着掺杂浓度的增加,能带隙从2.91 eV增加到3.33 eV。电测量证实了介电常数的增加,这使得这些材料对低频器件有效。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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