Role of electronic structure and order of bimetal nanoparticles coating in enhanced field emission response of vertically grown CNTs

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Materials Science: Materials in Electronics Pub Date : 2025-01-16 DOI:10.1007/s10854-025-14230-2
Shubham Saini, Santanu Ghosh, Pankaj Srivastava
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Abstract

The present study reports the synthesis of vertically aligned carbon nanotubes on a Si substrate using the thermal CVD technique, followed by the deposition of bimetals (Cu and Zn) via the thermal evaporation technique on the as-deposited CNTs. The structural properties, surface morphology, elemental composition, and electronic structure were studied using various characterization techniques. The J-E measurements carried out on all the samples revealed that the Cu–Zn–CNTs report a high current density of 9.94 mA/cm2 compared to pristine CNTs with 4.01 mA/cm2. A thorough study reveals the importance of the electronic structure in varying the current density. Along with the changes in the basic field emission parameters as work function reduction and increase in the field enhancement factor, the electron affinity of individual metal surfaces and their order of coating play a very important role in enhancing the current density for field emission applications.

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双金属纳米粒子包覆层的电子结构和顺序在增强垂直生长CNTs场发射响应中的作用
本研究报道了利用热CVD技术在Si衬底上合成垂直排列的碳纳米管,然后通过热蒸发技术在沉积的碳纳米管上沉积双金属(Cu和Zn)。利用各种表征技术研究了其结构性能、表面形貌、元素组成和电子结构。对所有样品进行的J-E测量显示,Cu-Zn-CNTs报告的电流密度高,为9.94 mA/cm2,而原始CNTs为4.01 mA/cm2。深入的研究揭示了电子结构对电流密度变化的重要性。随着基本场发射参数的变化,如功函数的减小和场增强因子的增加,单个金属表面的电子亲和力及其涂层顺序对提高场发射应用中的电流密度起着非常重要的作用。
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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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