2D Ruddlesden-Popper perovskite interface engineering for efficient perovskite solar cells with exceptional stability

IF 2.8 4区工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Materials Science: Materials in Electronics Pub Date : 2025-01-16 DOI:10.1007/s10854-024-14116-9

Mahnaz Mozaffari, Abbas Behjat, Mohammad Ali Haddad, Ali Benvidi, Hojjat Amrollahi Bioki

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Abstract

This paper presents an appropriate method of fabricating stable and efficient 3D (top)/2D (bottom) perovskite solar cells (PSCs). The method involves three-step spin-coating deposition, where 3D triple-cation perovskites are used as a light-absorbing material and phenyl trimethylammonium iodide (PTAI) serves to form a 2D Ruddlesden-Popper perovskite. Moisture penetration into the pores of porous structures is a significant degradation factor for perovskite porous solar cells. On the other hand, the high quality of the underlayer can play a crucial role in improving perovskite formation. In this study, different PTAI deposition processes were investigated for their effects on perovskite formation, surface morphology, optical properties, and device stability. As the results showed, a step-by-step post-annealing process after deposition was optimal for forming 2D perovskites, enhancing the device stability and efficiency. The efficiency of the optimized PSCs was improved for 24%, compared to the reference PSCs. Furthermore, this solar cell maintained 92% of its efficiency for a year.

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2D Ruddlesden-Popper钙钛矿界面工程，用于具有优异稳定性的高效钙钛矿太阳能电池

本文提出了一种制备稳定高效的三维（上）/二维（下）钙钛矿太阳能电池的合适方法。该方法涉及三步旋转涂层沉积，其中3D三阳离子钙钛矿用作吸光材料，苯基三甲基碘化铵（PTAI）用于形成2D Ruddlesden-Popper钙钛矿。水分渗透到多孔结构的孔隙中是钙钛矿多孔太阳能电池的一个重要退化因素。另一方面，高质量的下层对钙钛矿的形成起着至关重要的作用。在本研究中，研究了不同的PTAI沉积工艺对钙钛矿形成、表面形貌、光学性质和器件稳定性的影响。结果表明，沉积后分步退火工艺是形成二维钙钛矿的最佳工艺，提高了器件的稳定性和效率。与参考PSCs相比，优化后的PSCs的效率提高了24%。此外，这种太阳能电池在一年内保持了92%的效率。

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来源期刊

Journal of Materials Science: Materials in Electronics 工程技术-材料科学：综合

CiteScore

5.00

自引率

7.10%

发文量

1931

审稿时长

2 months

期刊介绍： The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.