Investigation of phase formation of Bi₂Sr₂CaCu₂O₈₊ₓ under oxygen-free conditions and its application in resistance switching

IF 4.2 3区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Materials Science in Semiconductor Processing Pub Date : 2025-02-16 DOI:10.1016/j.mssp.2025.109378
Jiqiang Jia, Tao Zhang, Li Lei
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Abstract

This paper investigates the growth process of Bi₂Sr₂CaCu₂O₈₊ₓ (Bi-2212) films using the pulsed laser deposition method in both oxygen and oxygen-free (nitrogen) conditions. Furthermore, the resistance switching (RS) effect of Bi-2212/Nb: SrTiO₃ (NSTO) structure is explored. Bi-2212 films are deposited in oxygen and nitrogen atmospheres respectively, and the effects of laser energy, deposition temperature, atmospheric pressure, and oxygen diffusion process on phase formation and superconductivity are thoroughly studied. The high-quality Bi-2212 phase can be obtained at a deposition temperature of 800 °C, laser energy of 250 mJ, and an oxygen or nitrogen pressure of 65 Pa. The low-temperature diffusion process further enhances the superconducting properties, with oxygen-diffused samples exhibiting critical transition temperatures of approximately 83 K (deposition in oxygen) and 74 K (deposition in nitrogen). Additionally, the RS effect of Bi-2212/NSTO structures is investigated, where Bi-2212 is used as both the electrode and the hetero-layer for NSTO. Oxygen vacancies inherently present in Bi-2212 migrate to the Bi-2212/NSTO interface under low voltage, increasing the interfacial barrier. However, as the bias voltage progressively increases, oxygen ions in NSTO migrate into Bi-2212, resulting in the formation of Vo on the NSTO side, thereby reducing the interfacial barrier height. As a result, the Bi-2212/NSTO structure exhibits two different RS characteristics under different voltages. These results provide experimental references for the application of Bi-2212 in oxidizable substrates, circuits, and RS effect devices.
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来源期刊
Materials Science in Semiconductor Processing
Materials Science in Semiconductor Processing 工程技术-材料科学:综合
CiteScore
8.00
自引率
4.90%
发文量
780
审稿时长
42 days
期刊介绍: Materials Science in Semiconductor Processing provides a unique forum for the discussion of novel processing, applications and theoretical studies of functional materials and devices for (opto)electronics, sensors, detectors, biotechnology and green energy. Each issue will aim to provide a snapshot of current insights, new achievements, breakthroughs and future trends in such diverse fields as microelectronics, energy conversion and storage, communications, biotechnology, (photo)catalysis, nano- and thin-film technology, hybrid and composite materials, chemical processing, vapor-phase deposition, device fabrication, and modelling, which are the backbone of advanced semiconductor processing and applications. Coverage will include: advanced lithography for submicron devices; etching and related topics; ion implantation; damage evolution and related issues; plasma and thermal CVD; rapid thermal processing; advanced metallization and interconnect schemes; thin dielectric layers, oxidation; sol-gel processing; chemical bath and (electro)chemical deposition; compound semiconductor processing; new non-oxide materials and their applications; (macro)molecular and hybrid materials; molecular dynamics, ab-initio methods, Monte Carlo, etc.; new materials and processes for discrete and integrated circuits; magnetic materials and spintronics; heterostructures and quantum devices; engineering of the electrical and optical properties of semiconductors; crystal growth mechanisms; reliability, defect density, intrinsic impurities and defects.
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