Experimental and computational insights into CuS-Mg composites for high-performance p-type transparent conducting materials.

IF 12.2 2区 材料科学 Q1 CHEMISTRY, MULTIDISCIPLINARY Materials Horizons Pub Date : 2025-02-28 DOI:10.1039/d4mh01501k
Stener Lie, Qingde Sun, Pritish Mishra, Patrick Wen Feng Li, Anupam Sadhu, Teddy Salim, Shuzhou Li, Geoffroy Hautier, Lydia Helena Wong
{"title":"Experimental and computational insights into CuS-Mg composites for high-performance p-type transparent conducting materials.","authors":"Stener Lie, Qingde Sun, Pritish Mishra, Patrick Wen Feng Li, Anupam Sadhu, Teddy Salim, Shuzhou Li, Geoffroy Hautier, Lydia Helena Wong","doi":"10.1039/d4mh01501k","DOIUrl":null,"url":null,"abstract":"<p><p>Achieving fully transparent electronic devices requires improving p-type transparent conducting materials (TCMs) to match their n-type counterparts. This study explores novel p-type TCMs using high-throughput screening <i>via</i> an automatic spray pyrolysis system. The performance of conducting wide bandgap chalcogenide based on CuS can be improved by incorporating various cations, with Mg emerging as the most promising candidate. The optimized CuS-Mg films exhibited superior transparency and conductivity, comparable to state-of-the-art p-type TCMs. Density functional theory (DFT) calculations linked the inverse correlation between transparency and conductivity to changes in Cu 3d and S 3p orbital coupling with varying Mg content. The best CuS-Mg composition demonstrated high hole concentration (5 × 10<sup>21</sup> cm<sup>-3</sup>), low sheet resistance (266 Ω □<sup>-1</sup>), and high transparency (∼75%). The transmittance increased by ∼30% compared with pristine CuS. The successful application of a p-CuS-Mg/n-CdS heterojunction as a semi-transparent photodiode highlights its potential for smart displays and window-integrated electronics. This study demonstrates the value of combining experimental and theoretical methods for accelerated material discovery.</p>","PeriodicalId":87,"journal":{"name":"Materials Horizons","volume":" ","pages":""},"PeriodicalIF":12.2000,"publicationDate":"2025-02-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Materials Horizons","FirstCategoryId":"88","ListUrlMain":"https://doi.org/10.1039/d4mh01501k","RegionNum":2,"RegionCategory":"材料科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q1","JCRName":"CHEMISTRY, MULTIDISCIPLINARY","Score":null,"Total":0}
引用次数: 0

Abstract

Achieving fully transparent electronic devices requires improving p-type transparent conducting materials (TCMs) to match their n-type counterparts. This study explores novel p-type TCMs using high-throughput screening via an automatic spray pyrolysis system. The performance of conducting wide bandgap chalcogenide based on CuS can be improved by incorporating various cations, with Mg emerging as the most promising candidate. The optimized CuS-Mg films exhibited superior transparency and conductivity, comparable to state-of-the-art p-type TCMs. Density functional theory (DFT) calculations linked the inverse correlation between transparency and conductivity to changes in Cu 3d and S 3p orbital coupling with varying Mg content. The best CuS-Mg composition demonstrated high hole concentration (5 × 1021 cm-3), low sheet resistance (266 Ω □-1), and high transparency (∼75%). The transmittance increased by ∼30% compared with pristine CuS. The successful application of a p-CuS-Mg/n-CdS heterojunction as a semi-transparent photodiode highlights its potential for smart displays and window-integrated electronics. This study demonstrates the value of combining experimental and theoretical methods for accelerated material discovery.

查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
高性能 p 型透明导电材料 CuS-Mg 复合材料的实验和计算研究。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
Materials Horizons
Materials Horizons CHEMISTRY, MULTIDISCIPLINARY-MATERIALS SCIENCE, MULTIDISCIPLINARY
CiteScore
18.90
自引率
2.30%
发文量
306
审稿时长
1.3 months
期刊介绍: Materials Horizons is a leading journal in materials science that focuses on publishing exceptionally high-quality and innovative research. The journal prioritizes original research that introduces new concepts or ways of thinking, rather than solely reporting technological advancements. However, groundbreaking articles featuring record-breaking material performance may also be published. To be considered for publication, the work must be of significant interest to our community-spanning readership. Starting from 2021, all articles published in Materials Horizons will be indexed in MEDLINE©. The journal publishes various types of articles, including Communications, Reviews, Opinion pieces, Focus articles, and Comments. It serves as a core journal for researchers from academia, government, and industry across all areas of materials research. Materials Horizons is a Transformative Journal and compliant with Plan S. It has an impact factor of 13.3 and is indexed in MEDLINE.
期刊最新文献
Droplet-templating soft materials into structured bead-based aerogels with compartmentalized or welded configurations. Experimental and computational insights into CuS-Mg composites for high-performance p-type transparent conducting materials. Neuromorphic devices for electronic skin applications. Optimizing optical anisotropy in low-dimensional structures via intralayer hydrogen bonding modulation and anionic substitution. A linearly programmable strategy for polymer elastomer mechanics.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1