Modeling and Analysis of Vibration Coupling in Differential Common-Based MEMS Resonators.

IF 3 3区 工程技术 Q2 CHEMISTRY, ANALYTICAL Micromachines Pub Date : 2025-01-30 DOI:10.3390/mi16020169
Jing Zhang, Zhuo Yang, Tianhao Wu, Zhichao Yao, Chen Lin, Yan Su
{"title":"Modeling and Analysis of Vibration Coupling in Differential Common-Based MEMS Resonators.","authors":"Jing Zhang, Zhuo Yang, Tianhao Wu, Zhichao Yao, Chen Lin, Yan Su","doi":"10.3390/mi16020169","DOIUrl":null,"url":null,"abstract":"<p><p>In differential MEMS resonant sensors, a pair of resonators are interconnected with other structural components while sharing a common substrate. This leads to mutual coupling of vibration energy between resonators, interfering with their frequency outputs and affecting the sensor's static performance. This paper aims to model and analyze the vibration coupling phenomena in differential common-based MEMS resonators (DCMR). A mechanical model of the DCMR structure was established and refined through finite element simulation analysis. Theoretical calculations yielded vibration coupling curves for two typical silicon resonant accelerometer (SRA) structures containing DCMR: SRA-V1 and SRA-V2, with coupling stiffness values of 2.361 × 10<sup>-4</sup> N/m and 1.370 × 10<sup>-2</sup> N/m, respectively. An experimental test system was constructed to characterize the vibration coupling behavior. The results provided coupling amplitude-frequency characteristic curves and coupling stiffness values (7.073 × 10<sup>-4</sup> N/m and 1.068 × 10<sup>-2</sup> N/m for SRA-V1 and SRA-V2, respectively) that validated the theoretical analysis and computational model. This novel approach enables effective evaluation of coupling intensity between 5resonators and provides a theoretical foundation for optimizing device structural designs.</p>","PeriodicalId":18508,"journal":{"name":"Micromachines","volume":"16 2","pages":""},"PeriodicalIF":3.0000,"publicationDate":"2025-01-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC11857217/pdf/","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Micromachines","FirstCategoryId":"5","ListUrlMain":"https://doi.org/10.3390/mi16020169","RegionNum":3,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"Q2","JCRName":"CHEMISTRY, ANALYTICAL","Score":null,"Total":0}
引用次数: 0

Abstract

In differential MEMS resonant sensors, a pair of resonators are interconnected with other structural components while sharing a common substrate. This leads to mutual coupling of vibration energy between resonators, interfering with their frequency outputs and affecting the sensor's static performance. This paper aims to model and analyze the vibration coupling phenomena in differential common-based MEMS resonators (DCMR). A mechanical model of the DCMR structure was established and refined through finite element simulation analysis. Theoretical calculations yielded vibration coupling curves for two typical silicon resonant accelerometer (SRA) structures containing DCMR: SRA-V1 and SRA-V2, with coupling stiffness values of 2.361 × 10-4 N/m and 1.370 × 10-2 N/m, respectively. An experimental test system was constructed to characterize the vibration coupling behavior. The results provided coupling amplitude-frequency characteristic curves and coupling stiffness values (7.073 × 10-4 N/m and 1.068 × 10-2 N/m for SRA-V1 and SRA-V2, respectively) that validated the theoretical analysis and computational model. This novel approach enables effective evaluation of coupling intensity between 5resonators and provides a theoretical foundation for optimizing device structural designs.

查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
基于差分共振的微机电系统谐振器振动耦合建模与分析
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
相关文献
Editorial for the Special Issue on Recent Advances in Thin Film Electronic Devices.
IF 3.4 3区 材料科学ACS Applied Electronic MaterialsPub Date : 2022-09-01 DOI: 10.3390/mi13091445
Chengyuan Dong
Guest Editorial – Special Issue on ‘Memristors: Devices, Models, Circuits, Systems, and Applications’
IF 2.3 3区 工程技术International Journal of Circuit Theory and ApplicationsPub Date : 2018-01-22 DOI: 10.1002/cta.2444
Ronald Tetzlaff, Fernando Corinto, Rogrigo Picos, Maciej Ogorzalek
Editorial for the Special Issue on Robust Microelectronic Devices
IF 2.7 4区 材料科学CrystalsPub Date : 2021-12-23 DOI: 10.3390/cryst12010016
M. Waltl
来源期刊
Micromachines
Micromachines NANOSCIENCE & NANOTECHNOLOGY-INSTRUMENTS & INSTRUMENTATION
CiteScore
5.20
自引率
14.70%
发文量
1862
审稿时长
16.31 days
期刊介绍: Micromachines (ISSN 2072-666X) is an international, peer-reviewed open access journal which provides an advanced forum for studies related to micro-scaled machines and micromachinery. It publishes reviews, regular research papers and short communications. Our aim is to encourage scientists to publish their experimental and theoretical results in as much detail as possible. There is no restriction on the length of the papers. The full experimental details must be provided so that the results can be reproduced.
期刊最新文献
Mode Optimization of Microelectromechanical-System Traveling-Wave Ultrasonic Motor Based on Kirigami. An Optimized PZT-FBG Voltage/Temperature Sensor. Coded Ultrasonic Ranging for the Distance Measurement of Coaxial Rotor Blades. FLIM-Phasor Analysis (FLIM-ϕ) of Aβ-Induced Membrane Order Alterations: Towards a Cell-Based Biosensor for Early Alzheimer's Disease Diagnosis. Dielectrophoretic Microfluidic Designs for Precision Cell Enrichments and Highly Viable Label-Free Bacteria Recovery from Blood.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1