Flexible strain sensors based on carbon nanotubes and silver nanowires and polydimethylsiloxane

IF 2.8 4区 工程技术 Q2 ENGINEERING, ELECTRICAL & ELECTRONIC Journal of Materials Science: Materials in Electronics Pub Date : 2025-03-10 DOI:10.1007/s10854-025-14498-4
A. Duan, X. Lin, T. Ding, Y. Sun, L. Wang, C. Huang, B. Li, Y. Wang
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引用次数: 0

Abstract

Flexible strain sensors with varied architectures were fabricated via depositing mixtures or stacked layers of AgNWs and SWCNT/MWCNT onto PDMS substrates. A comprehensive investigation was conducted to uncover how sensor construction and materials impact the conductivity of the sensing layer, along with key performance metrics such as sensitivity, linearity, hysteresis, and repeatability. A systematic exploration was then carried out to analyze the effect of the sensor structure and materials on the sensing layer’s conductivity, as well as its sensitivity, linearity, hysteresis, and repeatability. Experimental results show that the sensor with a MWCNT (inside)-AgNWs (surface) stacked structure showcases outstanding capabilities. In the range of 0–100% tensile strain, it shows a high sensitivity (GF = 0.98), a low nonlinear error of 2.97%, and an ultrafast response time of 0.122 s. After subjecting it to 150 strain cycles, the sensitivity only drops to 0.996. Moreover, it can precisely detect finger motions across angles of 0°, 30°, 60°, 90°, and 120°. These advantages suggest that the sensor holds great potential for applications in wearable controllers and motion detection fields.

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来源期刊
Journal of Materials Science: Materials in Electronics
Journal of Materials Science: Materials in Electronics 工程技术-材料科学:综合
CiteScore
5.00
自引率
7.10%
发文量
1931
审稿时长
2 months
期刊介绍: The Journal of Materials Science: Materials in Electronics is an established refereed companion to the Journal of Materials Science. It publishes papers on materials and their applications in modern electronics, covering the ground between fundamental science, such as semiconductor physics, and work concerned specifically with applications. It explores the growth and preparation of new materials, as well as their processing, fabrication, bonding and encapsulation, together with the reliability, failure analysis, quality assurance and characterization related to the whole range of applications in electronics. The Journal presents papers in newly developing fields such as low dimensional structures and devices, optoelectronics including III-V compounds, glasses and linear/non-linear crystal materials and lasers, high Tc superconductors, conducting polymers, thick film materials and new contact technologies, as well as the established electronics device and circuit materials.
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