{"title":"Influence of underfill methods on the solder joint fatigue of wafer level packaging","authors":"C. Regard, C. Gautier, H. Frémont, P. Poirier","doi":"10.1109/ICEPT.2008.4607137","DOIUrl":null,"url":null,"abstract":"To increase miniaturization, CSWLP (chip size wafer level packaging) has been developed. However, the difficulty to get good solder joint reliability leads to manufacture only small CSWLP modules. Different underfill methods are evaluated here, by measurements and simulations: results prove that underfill is necessary, but a bad choice can also decrease the reliability. An original method called ldquore-enforcementrdquo improves the life time.","PeriodicalId":6324,"journal":{"name":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","volume":"132 1","pages":"1-6"},"PeriodicalIF":0.0000,"publicationDate":"2008-07-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2008.4607137","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
To increase miniaturization, CSWLP (chip size wafer level packaging) has been developed. However, the difficulty to get good solder joint reliability leads to manufacture only small CSWLP modules. Different underfill methods are evaluated here, by measurements and simulations: results prove that underfill is necessary, but a bad choice can also decrease the reliability. An original method called ldquore-enforcementrdquo improves the life time.
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