Limitations of gluing as a replacement of ultrasonic welding: Attaching Lithium battery contacts to PCBs

N. B. P. Aguilera, J. Mollinger, J. Bastemeijer, J. Zhou, P. French, A. Bossche
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Abstract

Rechargeable shapeable Lithium batteries have been in research and development by Philips in the last years resulting in an option to optimize the size of a System-in-Package. In a previous work, it was shown that gluing can replace ultrasonic welding in low power applications, nevertheless, the glued contacts require of a material to protect them from humidity in order to avoid corrosion. In this work, the reliability of the glued and welded contacts is studied, when protected by a glob top material. The contact resistance of the bonds is measured before and after a high humidity and temperature aging process. If the contacts present a change of resistance of less than 20% after the reliability test, the test is considered a pass. The welded contacts presented a change in resistance of less that 20% and the glued contacts of at least 50%. The welded contacts protected with a high purity UV curable material are the most reliable.
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用胶水代替超声波焊接的局限性:将锂电池触点连接到pcb上
在过去的几年里,飞利浦一直在研究和开发可充电的可成型锂电池,从而优化了系统级封装的尺寸。在之前的工作中,研究表明,在低功耗应用中,胶接可以取代超声波焊接,然而,胶接的触点需要一种材料来保护它们免受湿度的影响,以避免腐蚀。在这项工作中,研究了粘接和焊接触点的可靠性,当有一个球形的顶部材料保护。在高湿、高温老化过程前后测量焊条的接触电阻。如果在可靠性测试后触点的电阻变化小于20%,则认为测试通过。焊接触点的电阻变化小于20%,而粘接触点的电阻变化至少为50%。采用高纯度UV固化材料保护的焊接触点是最可靠的。
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Comparison the reliability of small plated-through hole with different diameters under thermal stress Co-simulation of capacitive coupling pads assignment for capacitive coupling interconnection applications Microstructure evolution in a sandwich structure of Ni/SnAg/Ni microbump during reflow Comparison among individual thermal cycling, vibration test and the combined test for the life estimation of electronic components Limitations of gluing as a replacement of ultrasonic welding: Attaching Lithium battery contacts to PCBs
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