High speed silicon lateral trench detector on SOI substrate

Min Yang, Jeremy D. Schaub, Dennis L. Rogers, M. B. Ritter, K. Rim, J. J. Welser, Byeongju Park
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引用次数: 16

Abstract

Lateral trench photodetectors (LTD) on silicon-on-insulator (SOI) have been fabricated using a fully CMOS compatible process. High speed (2.0 GHz), high quantum efficiency (51%), and excellent frequency response characteristics have been achieved at 851 nm with a supply voltage of only 3.3 V.
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基于SOI衬底的高速硅横向沟槽探测器
采用完全兼容CMOS的工艺制备了绝缘体上硅(SOI)的横向沟槽光电探测器(LTD)。在851 nm下,以3.3 V的电源电压实现了高速(2.0 GHz)、高量子效率(51%)和优异的频率响应特性。
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