Trenched sinker LDMOSFET (TS-LDMOS) structure for high power amplifier application above 2 GHz

C. Kim, Joung-Woo Park, Hyun-Kyu Yu
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引用次数: 12

Abstract

New trenched sinker LDMOSFET structure is proposed for the application of high power RF amplifier. By adopting low temperature deep trench technology, the sinker area can be shrunk down more than 70% compared with the conventional diffusion type. The RF performance of proposed device with channel width of 5 mm showed a small signal gain of 19.3 dB at 2 GHz and 14.8 dB at 3 GHz, and maximum peak power of 30 dBm at V/sub DD/ of 26 V. Furthermore, the trench sinker (or guard), that is applied to suppress the coupling between inductors, also showed a excellent blocking performance at frequency range from 0.5 GHz to 20 GHz.
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用于2 GHz以上高功率放大器应用的沟槽下沉型LDMOSFET (TS-LDMOS)结构
提出了一种用于大功率射频放大器的新型沟槽下沉型LDMOSFET结构。采用低温深沟技术,与常规扩散型相比,沉降面积可缩小70%以上。通道宽度为5 mm的器件在2 GHz和3 GHz时的信号增益分别为19.3 dB和14.8 dB,在V/sub DD/为26 V时的最大峰值功率为30 dBm。此外,用于抑制电感之间耦合的沟槽接收器(或保护器)在0.5 GHz至20 GHz的频率范围内也表现出优异的阻挡性能。
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