Reflow influence for Sn96.7-Ag3.7 polymer core solder ball in BGA package

Abstract

To seek and implement the high-speed circuit products, the high-pin count package is necessary to be considered well. Adopting polymer core solder ball in ball-grid-array (BGA) package instead of solid solder ball in cost and reliability consideration is a practical selection. After the reflow process, the outward appearance for polymer solder ball shows the better quality, especially in oxidation effect. The uniformity of stand-off height performance for polymer solder ball without flux assistance is better than that for solid solder ball. After shearing test, the adhesion capability for polymer core solder ball on carrier substrate still represents the good performance, compared with solid solder ball.