S. Purushothaman, S. Nitta, J. G. Ryan, C. Narayan, M. Krishnan, S. Cohen, S. Gates, S. Whitehair, J. Hedrick, C. Tyberg, S. Greco, K. Rodbell, E. Huang, T. Dalton, R. Dellaguardia, K. Saenger, E. Simonyi, S.T. Chen, K. Malone, R. Miller, W. Volksen
{"title":"Opportunities and challenges in ultra low k dielectrics for interconnect applications","authors":"S. Purushothaman, S. Nitta, J. G. Ryan, C. Narayan, M. Krishnan, S. Cohen, S. Gates, S. Whitehair, J. Hedrick, C. Tyberg, S. Greco, K. Rodbell, E. Huang, T. Dalton, R. Dellaguardia, K. Saenger, E. Simonyi, S.T. Chen, K. Malone, R. Miller, W. Volksen","doi":"10.1109/IEDM.2001.979561","DOIUrl":null,"url":null,"abstract":"In this paper, we discuss the challenges associated with producing, characterizing and integrating porous dielectrics into back-end-of-line (BEOL) interconnects and present results from our integration evaluations.","PeriodicalId":13825,"journal":{"name":"International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224)","volume":"14 1","pages":"23.2.1-23.2.4"},"PeriodicalIF":0.0000,"publicationDate":"2001-12-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Electron Devices Meeting. Technical Digest (Cat. No.01CH37224)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2001.979561","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
In this paper, we discuss the challenges associated with producing, characterizing and integrating porous dielectrics into back-end-of-line (BEOL) interconnects and present results from our integration evaluations.
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