H. Rhee, Ilryong Kim, Jaehun Jeong, Nakjin Son, Heebum Hong, Sungil Cho, Yongsoon Park, Dongwoo Kim, Yunki Choi, Jeonghoon Ahn, S. Kang, K. Yeo, Jungtae Kim, Euncheol Lee, J. Youn, J. Yoon
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引用次数: 8
Abstract
8LPP logic platform technology supports mobile and high-performance and lower power application especially for mobile, artificial intelligence (AI), and cryptocurrency devices. 8LPP is employing the evolutionary generation of bulk FinFET FEOL and 44nm EUV-less multi-patterning BEOL process, resulting in 7% power reduction and ~15% area scaling compared with the previous 10LPP. The cost-effective high volume manufacturing is achieved with the minimum additional critical layers and the comparable process steps over the current high volume 10nm production.
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