H. Theuss, C. Geissler, Franz-Xaver Muehlbauer, Claus von Waechter, T. Kilger, J. Wagner, T. Fischer, U. Bartl, Stephan Helbig, A. Sigl, D. Maier, B. Goller, Matthias Vobl, M. Herrmann, J. Lodermeyer, U. Krumbein, A. Dehé
{"title":"A MEMS Microphone in a FOWLP","authors":"H. Theuss, C. Geissler, Franz-Xaver Muehlbauer, Claus von Waechter, T. Kilger, J. Wagner, T. Fischer, U. Bartl, Stephan Helbig, A. Sigl, D. Maier, B. Goller, Matthias Vobl, M. Herrmann, J. Lodermeyer, U. Krumbein, A. Dehé","doi":"10.1109/ECTC.2019.00134","DOIUrl":null,"url":null,"abstract":"This work presents a fully functional miniaturized MEMS microphone demonstrator assembled within a modified Fan Out Wafer Level Package (FOWLP) process chain. Core of the development is the adaption of the FOWLP-process to MEMS-microphones, which have not yet been fully processed in the wafer fab. Instead, these microphone chips contain non-released membranes making them sufficiently robust to withstand backend processes, such as laminating and molding. The membrane release itself is performed on the reconstituted mold-wafer and postponed to a later process step. Mechanical stress effects induced by the package onto the MEMS are limited to a minimum by the implementation of stress decoupling suspension structures on the MEMS die.","PeriodicalId":6726,"journal":{"name":"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)","volume":"110 1","pages":"855-860"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2019.00134","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
This work presents a fully functional miniaturized MEMS microphone demonstrator assembled within a modified Fan Out Wafer Level Package (FOWLP) process chain. Core of the development is the adaption of the FOWLP-process to MEMS-microphones, which have not yet been fully processed in the wafer fab. Instead, these microphone chips contain non-released membranes making them sufficiently robust to withstand backend processes, such as laminating and molding. The membrane release itself is performed on the reconstituted mold-wafer and postponed to a later process step. Mechanical stress effects induced by the package onto the MEMS are limited to a minimum by the implementation of stress decoupling suspension structures on the MEMS die.
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