Rui Liu, Hong Wang, Xueping Li, Jun Tang, Shengping Mao, G. Ding
{"title":"Design of testing chip for measuring mechanical properties of thin films","authors":"Rui Liu, Hong Wang, Xueping Li, Jun Tang, Shengping Mao, G. Ding","doi":"10.1109/ICEPT.2008.4607079","DOIUrl":null,"url":null,"abstract":"Uniaxial tensile test is the most reliable way to measure mechanical properties of thin films. The difficulties of uniaxial tensile test are how to fabricate small and stress-free specimen, align and trip the specimen, generate small forces and measure strain. A novel tensile testing chip to measure thin film specimens with large elongation was proposed in this paper, and it was fabricated by UV-LIGA (Ultraviolet Lithographie GalVanoformung Abformung) technology. This novel testing chip has good alignment and can endure large deformation.","PeriodicalId":6324,"journal":{"name":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2008-07-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2008.4607079","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Uniaxial tensile test is the most reliable way to measure mechanical properties of thin films. The difficulties of uniaxial tensile test are how to fabricate small and stress-free specimen, align and trip the specimen, generate small forces and measure strain. A novel tensile testing chip to measure thin film specimens with large elongation was proposed in this paper, and it was fabricated by UV-LIGA (Ultraviolet Lithographie GalVanoformung Abformung) technology. This novel testing chip has good alignment and can endure large deformation.
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