Solder Joint Reliability of Double-Side Mounted DDR Modules for Consumer and Automotive Applications

2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Pub Date : 2019-05-28 DOI:10.1109/ECTC.2019.00080

Dongji Xie, Joe Hai, Zhongming Wu, M. Economou

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引用次数: 2

Abstract

This paper describes solder joint reliability studies for DDR memories using single side and double side mount modules in the application of consumer and automotive fields. The types of DDRs include LPDDR4 and GDDR5. The components are from well-known memory manufacturers. Both experimental work and numerical simulation are employed to understand the reliability and failure mechanisms. It is found the reliability of DDRs changes with different DDR types as well as suppliers. LPDDR4 has much lower reliability as compared to that of GDDR5. The reason is the low ball profile which has increased the thermal stress for LPDDR4. However, the most critical factor is the double side mount vs. single side mount configuration. Both experimental and FEA results show corner fill may be a better choice in handling both mechanical and thermal stresses. To enhance the solder joint reliability, one effective way is to employ corner fill, edge bond or underfill. However, in order to get better reliability, corner fill and underfill are normally recommended.

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消费类和汽车应用的双面安装DDR模块的焊点可靠性

本文介绍了在消费和汽车领域应用的单侧和双侧安装模块DDR存储器的焊点可靠性研究。ddr的类型包括LPDDR4和GDDR5。这些组件来自知名的存储器制造商。采用实验和数值模拟相结合的方法来了解其可靠性和失效机理。研究发现，DDR的可靠性随DDR类型和供应商的不同而变化。与GDDR5相比，LPDDR4的可靠性要低得多。原因是低球型增加了LPDDR4的热应力。然而，最关键的因素是双面安装与单面安装配置。实验结果和有限元分析结果都表明，角部填充在处理机械应力和热应力方面可能是较好的选择。提高焊点可靠性的一种有效方法是采用补角、补边或补底。然而，为了获得更好的可靠性，通常建议采用角填和底填。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

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