Curie temperature effects on resistance spot welding

T. H. Wu, P. Wei
{"title":"Curie temperature effects on resistance spot welding","authors":"T. H. Wu, P. Wei","doi":"10.1109/IMPACT.2011.6117206","DOIUrl":null,"url":null,"abstract":"The effects of the Curie temperature on transport variables and nugget growth during resistance spot welding are investigated. The Curie temperature is the temperature, indicating that magnetic transformation below which a metal or alloy is ferromagnetic with high magnetic permeability, and above which it is paramagnetic with small magnetic permeability. The model accounts for electromagnetic force, heat generations and contact resistances at the faying surface and electrode-workpiece interfaces and bulk resistance in workpieces. Contact resistance includes constriction and film resistances, which are functions of hardness, temperature, electrode force and surface condition. The computed results show that the molten nugget on the faying surface initiates earlier with a high Curie temperature. High Curie temperature readily melts through the workpiece surface near the electrode edge. The present work can also be applied to interpret the contact problems encountered in various electronics and packaging technologies, etc.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"160 1","pages":"179-183"},"PeriodicalIF":0.0000,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMPACT.2011.6117206","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

Abstract

The effects of the Curie temperature on transport variables and nugget growth during resistance spot welding are investigated. The Curie temperature is the temperature, indicating that magnetic transformation below which a metal or alloy is ferromagnetic with high magnetic permeability, and above which it is paramagnetic with small magnetic permeability. The model accounts for electromagnetic force, heat generations and contact resistances at the faying surface and electrode-workpiece interfaces and bulk resistance in workpieces. Contact resistance includes constriction and film resistances, which are functions of hardness, temperature, electrode force and surface condition. The computed results show that the molten nugget on the faying surface initiates earlier with a high Curie temperature. High Curie temperature readily melts through the workpiece surface near the electrode edge. The present work can also be applied to interpret the contact problems encountered in various electronics and packaging technologies, etc.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
居里温度对电阻点焊的影响
研究了电阻点焊过程中居里温度对输运变量和熔核生长的影响。居里温度是表明磁性转变的温度,低于该温度的金属或合金具有高磁导率的铁磁性,高于该温度的金属或合金具有小磁导率的顺磁性。该模型考虑了电磁力、热生成、接触面接触电阻、电极-工件界面接触电阻和工件体电阻。接触电阻包括收缩电阻和薄膜电阻,它们是硬度、温度、电极力和表面状况的函数。计算结果表明,在较高的居里温度下,熔核形成较早。高居里温度在靠近电极边缘的工件表面容易熔化。本文的工作也可以应用于解释各种电子和封装技术中遇到的接触问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
自引率
0.00%
发文量
0
期刊最新文献
Comparison the reliability of small plated-through hole with different diameters under thermal stress Co-simulation of capacitive coupling pads assignment for capacitive coupling interconnection applications Microstructure evolution in a sandwich structure of Ni/SnAg/Ni microbump during reflow Comparison among individual thermal cycling, vibration test and the combined test for the life estimation of electronic components Limitations of gluing as a replacement of ultrasonic welding: Attaching Lithium battery contacts to PCBs
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1