Spectrum response analysis for PCB with heating ICs in different heating conditions

Abstract

Coupling effects of both thermal and vibration loadings on printed circuit board (PCB) are of interest. This paper aims to study the random vibration excitation of PCB with four heating ICs that are used to emulate the temperature elevation during operations. Two levels of heating conditions as well as without heating are considered in this work. The vibration tests according to JESD22-B103-B are carried out to measure the random vibration response of PCB under the conditions of both with and without heating. The finite element (FE) model of PCB with heating ICs is constructed and performed spectrum response analysis with and without thermal effects. The temperature distributions on PCB are first verified and shown good agreement between finite element analysis (FEA) and experiments. The power spectral density (PSD) functions of the acceleration on the PCB in heating are also obtained and compared for both FEA and experiments. The RMS accelerations on the PCB can be calculated and matched well between the analytical and experimental results. The fatigue evaluation due to coupling loadings from thermal and vibration effects on the PCB is also addressed. This work presents the systematic approaches in studying spectrum response analysis of PCB with both thermal and vibration coupling loads and shows a very good agreement results between FEA and experiments.