Vacuum underfill technology for advanced packaging (IMPACT 2011)

2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) Pub Date : 2011-12-29 DOI:10.1109/IMPACT.2011.6117165
M. Hoshiyama, M. Hasegawa, T. Sato, H. Yoshii, O. Suzuki, K. Kotaka, T. Nagasaka, A. Horibe, Marie-Claude Paquet, M. Gaynes, C. Feger, K. Sakuma, J. Knickerbocker, Y. Orii, K. Terada, K. Ishikawa, Y. Hirayama
{"title":"Vacuum underfill technology for advanced packaging (IMPACT 2011)","authors":"M. Hoshiyama, M. Hasegawa, T. Sato, H. Yoshii, O. Suzuki, K. Kotaka, T. Nagasaka, A. Horibe, Marie-Claude Paquet, M. Gaynes, C. Feger, K. Sakuma, J. Knickerbocker, Y. Orii, K. Terada, K. Ishikawa, Y. Hirayama","doi":"10.1109/IMPACT.2011.6117165","DOIUrl":null,"url":null,"abstract":"We developed vacuum underfill (VCUF) technology for large die (>18 × 18 mm) with fine pitch area array bumps (< 150 μm pitch) to solve a critical underfill void issue. Material development and process optimization are the keys to realize a stable process for future package. It was also confirmed that the newly developed underfill materials have good reliability on the large die package with vacuum assisted underfill process.","PeriodicalId":6360,"journal":{"name":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","volume":"17 1","pages":"42-46"},"PeriodicalIF":0.0000,"publicationDate":"2011-12-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMPACT.2011.6117165","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

We developed vacuum underfill (VCUF) technology for large die (>18 × 18 mm) with fine pitch area array bumps (< 150 μm pitch) to solve a critical underfill void issue. Material development and process optimization are the keys to realize a stable process for future package. It was also confirmed that the newly developed underfill materials have good reliability on the large die package with vacuum assisted underfill process.
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
先进包装的真空下填充技术(IMPACT 2011)
我们开发了真空下填充(VCUF)技术，用于具有细间距区域阵列凸起(< 150 μm间距)的大型模具(>18 × 18 mm)，以解决关键的下填充空隙问题。材料开发和工艺优化是实现未来封装稳定工艺的关键。同时也证实了新开发的底填材料在真空辅助底填工艺的大型模具封装上具有良好的可靠性。
本文章由计算机程序翻译，如有差异，请以英文原文为准。
求助全文
约1分钟内获得全文 去求助
来源期刊
2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
2011 6th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)
自引率
0.00%
发文量
0
期刊最新文献
Comparison the reliability of small plated-through hole with different diameters under thermal stress Co-simulation of capacitive coupling pads assignment for capacitive coupling interconnection applications Microstructure evolution in a sandwich structure of Ni/SnAg/Ni microbump during reflow Comparison among individual thermal cycling, vibration test and the combined test for the life estimation of electronic components Limitations of gluing as a replacement of ultrasonic welding: Attaching Lithium battery contacts to PCBs
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号：481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们：info@booksci.cn
Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1