{"title":"Reduction of Ag Corrosion Rate During Decapsulation of Ag Wire Bond Packages","authors":"Young-Ja Kim, Jinho Hah, K. Moon, C. Wong","doi":"10.1109/ECTC.2019.00325","DOIUrl":null,"url":null,"abstract":"Ag wire-bonded packages have gained a lot of interest as a low-cost substitute material in lieu of Au wire-bonded packages. However, selective decapsulation still remains as challenges due to a corrosion on Ag wires, where Ag has a strong tendency to form a water-soluble Ag salt upon reaction with a conventional nitric acid etchant. This paper serves to present a chemical solution that can reduce corrosion on Ag wires during decapsulation process of the Ag wire-bonded packages. Also, our method is applicable for industry standard needs such as for decapsulation at high temperature.","PeriodicalId":6726,"journal":{"name":"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)","volume":"65 1","pages":"2359-2364"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2019.00325","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Ag wire-bonded packages have gained a lot of interest as a low-cost substitute material in lieu of Au wire-bonded packages. However, selective decapsulation still remains as challenges due to a corrosion on Ag wires, where Ag has a strong tendency to form a water-soluble Ag salt upon reaction with a conventional nitric acid etchant. This paper serves to present a chemical solution that can reduce corrosion on Ag wires during decapsulation process of the Ag wire-bonded packages. Also, our method is applicable for industry standard needs such as for decapsulation at high temperature.
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