Device considerations for high density and highly reliable 3D NAND flash cell in near future

Eun-seok Choi, Sung-Kye Park
{"title":"Device considerations for high density and highly reliable 3D NAND flash cell in near future","authors":"Eun-seok Choi, Sung-Kye Park","doi":"10.1109/IEDM.2012.6479011","DOIUrl":null,"url":null,"abstract":"Recently, we have suggested highly manufacturable and reliable 3D NAND flash cell called “SMArT”[1], which is intended to minimize both stack height and word line resistance. Because the storage node of this cell is charge trap nitride, its device characteristics were far different from conventional floating gate. In this paper, the key cell characteristics such as cell Vth distribution, disturbance, and reliability are compared with our FG cell of 2y node in chip level, and several future challenges for 3D era will be addressed.","PeriodicalId":6376,"journal":{"name":"2012 International Electron Devices Meeting","volume":"1 1","pages":"9.4.1-9.4.4"},"PeriodicalIF":0.0000,"publicationDate":"2012-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"88","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2012 International Electron Devices Meeting","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2012.6479011","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 88

Abstract

Recently, we have suggested highly manufacturable and reliable 3D NAND flash cell called “SMArT”[1], which is intended to minimize both stack height and word line resistance. Because the storage node of this cell is charge trap nitride, its device characteristics were far different from conventional floating gate. In this paper, the key cell characteristics such as cell Vth distribution, disturbance, and reliability are compared with our FG cell of 2y node in chip level, and several future challenges for 3D era will be addressed.
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在不久的将来,高密度和高可靠的3D NAND闪存单元的器件考虑
最近,我们提出了高度可制造和可靠的3D NAND闪存单元,称为“SMArT”[1],旨在最大限度地减少堆栈高度和字线电阻。由于该电池的存储节点是电荷阱氮化物,其器件特性与传统的浮栅有很大的不同。本文在芯片水平上比较了我们的2y节点FG cell的Vth分布、干扰和可靠性等关键特性,并提出了未来3D时代的几个挑战。
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