Frequency dielectric constant and loss tangent extracting of organic material using multi-length microstrip

S. Wu, Chi-Chang Lai, Hung-Hsiang Cheng, Yu-Che Tai, Chen-Chao Wang
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引用次数: 5

Abstract

Organic material using for packaging substrate is selected and multi-length microstrip lines in same trace width are designed and performed on it. Novel formulas deliver to extract dielectric constant and loss tangent varying with frequency for selected organic materials will be shown in this paper. Performances of microstrip lines are measured by Agilent vector network analyzer up to 20 GHz and SOLT calibration used to get two-port S-parameters. Then, novel formulas are used to extract material parameters in ADS software by measurement date.
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利用多长度微带提取有机材料的频率介电常数和损耗正切
选择有机材料作为封装基板,在其上设计并实现了相同走线宽度的多长度微带线。本文给出了对所选有机材料计算介电常数和损耗正切随频率变化的新公式。采用安捷伦20 GHz矢量网络分析仪测量微带线的性能,并采用SOLT校准获得双端口s参数。然后,利用新公式在ADS软件中根据测量数据提取材料参数。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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