Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology

2019 IEEE 69th Electronic Components and Technology Conference (ECTC) Pub Date : 2019-05-28 DOI:10.1109/ECTC.2019.00037

Kwang-Seong Choi, Y. Eom, Seok-Hwan Moon, Jiho Joo, leeseul Jeong, Kwangjoo Lee, Jung Hak Kim, Ju Hyeon Kim, G. Yoon, Kwang-Hee Lee, Chul-Hee Lee, Geun-Sik Ahn, Moo-Sup Shim

{"title":"Enhanced Performance of Laser-Assisted Bonding with Compression (LABC) Compared with Thermal Compression Bonding (TCB) Technology","authors":"Kwang-Seong Choi, Y. Eom, Seok-Hwan Moon, Jiho Joo, leeseul Jeong, Kwangjoo Lee, Jung Hak Kim, Ju Hyeon Kim, G. Yoon, Kwang-Hee Lee, Chul-Hee Lee, Geun-Sik Ahn, Moo-Sup Shim","doi":"10.1109/ECTC.2019.00037","DOIUrl":null,"url":null,"abstract":"A LABC (Laser-Assisted Bonding with Compression) bonder and NCF (Non-Conductive Film) were developed to increase the productivity of the bonding process for the advanced microelectronic packaging technology. The design features of a LABC make its UPH above 1,000. The NCF was applied to both of LAB and TCB (Thermal Compression Bonding Technology). The 780µm-thick daisy chain top and bottom chips with the minimum pitch of 30µm and bump number of about 27,000 were prepared and tested to verify the LABC and NCF technology. The effects of the laser power on the joints quality after the LABC bonding process were investigated and compared with the joints formed by the TCB technology. Finally, the SAT (Scanning Acoustic Tomography) images of the test vehicles before and after the TCO (Pressurized oven) were observed to check the voids in the NCF after the LABC bonding process.","PeriodicalId":6726,"journal":{"name":"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)","volume":"68 1","pages":"197-203"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"9","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2019.00037","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 9

Abstract

A LABC (Laser-Assisted Bonding with Compression) bonder and NCF (Non-Conductive Film) were developed to increase the productivity of the bonding process for the advanced microelectronic packaging technology. The design features of a LABC make its UPH above 1,000. The NCF was applied to both of LAB and TCB (Thermal Compression Bonding Technology). The 780µm-thick daisy chain top and bottom chips with the minimum pitch of 30µm and bump number of about 27,000 were prepared and tested to verify the LABC and NCF technology. The effects of the laser power on the joints quality after the LABC bonding process were investigated and compared with the joints formed by the TCB technology. Finally, the SAT (Scanning Acoustic Tomography) images of the test vehicles before and after the TCO (Pressurized oven) were observed to check the voids in the NCF after the LABC bonding process.

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激光辅助压缩键合(LABC)与热压缩键合(TCB)技术性能的比较

针对先进微电子封装技术，开发了LABC(激光辅助键合与压缩)键合器和NCF(非导电膜)键合器，提高了键合工艺的生产率。LABC的设计特点使其UPH在1000以上。将NCF应用于LAB和TCB(热压缩粘接技术)。为验证LABC和NCF技术，制备了厚度为780 μ m、最小间距为30 μ m、凹凸数约为27,000的菊花链顶部和底部芯片。研究了激光功率对LABC焊接后接头质量的影响，并与TCB焊接后的接头进行了比较。最后，通过观察试验车辆加压炉(TCO)前后的SAT(扫描声层析成像)图像，检查LABC粘结过程后NCF中的空隙。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2019 IEEE 69th Electronic Components and Technology Conference (ECTC)

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