High thermal dissipation of light emitting diodes by integrating thin film process and packaging technology

Abstract

We report a brand new technique which is merged thin film fabrication process and packaging technology together to form the shortest thermal dissipation path of LED structure. The effective thermal resistance of the proposed LED was 3.54K/W, which is much better than that of the conventional one 10.8K/W and the operating current can be driven from original 230mA up to 800mA. These results indicate that the LED structure based on our work is useful in improving the performance by enabling great heat dissipation and have higher application potential than conventional one.