{"title":"Study of plasticity damage mechanics constitutive model for SnAgCu solder joint","authors":"Xiaoyan Li, Yongchang Yan, Na Liu","doi":"10.1109/ICEPT.2008.4607158","DOIUrl":null,"url":null,"abstract":"A thermodynamics-based damage mechanics rate dependent constitutive model is used to simulate experiments conducted on thin layer eutectic SnAgCu(SAC) solder joints. The non-damage constitutive is measured by bulk tensile test. The relationship between true stress and strain is sigma=85.26epsiv0.3536. Damage evolution equation is proposed based Lemaitre ductile damage theory and the constant in the equation is measured by unloading elastic modulus method. The damage evolution equation is D=1.0689epsivP-0.0008. Simulation (using software Ansys 9.0) of shear test of solder joint between Cu sticks employing damage mechanics rate independent constitutive is uniform to practicable test.","PeriodicalId":6324,"journal":{"name":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","volume":"56 1","pages":"1-4"},"PeriodicalIF":0.0000,"publicationDate":"2008-07-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2008 International Conference on Electronic Packaging Technology & High Density Packaging","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICEPT.2008.4607158","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
A thermodynamics-based damage mechanics rate dependent constitutive model is used to simulate experiments conducted on thin layer eutectic SnAgCu(SAC) solder joints. The non-damage constitutive is measured by bulk tensile test. The relationship between true stress and strain is sigma=85.26epsiv0.3536. Damage evolution equation is proposed based Lemaitre ductile damage theory and the constant in the equation is measured by unloading elastic modulus method. The damage evolution equation is D=1.0689epsivP-0.0008. Simulation (using software Ansys 9.0) of shear test of solder joint between Cu sticks employing damage mechanics rate independent constitutive is uniform to practicable test.
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