R. Sivasubramony, A. Zachariah, M. Alhendi, M. Yadav, P. Borgesen, M. Poliks, N. Stoffel, D. Shaddock, L. Yin
{"title":"Assessing the Reliability of Highly Stretchable Interconnects for Flexible Hybrid Electronics","authors":"R. Sivasubramony, A. Zachariah, M. Alhendi, M. Yadav, P. Borgesen, M. Poliks, N. Stoffel, D. Shaddock, L. Yin","doi":"10.1109/ECTC.2019.00122","DOIUrl":null,"url":null,"abstract":"Highly stretchable, bio-compatible interconnects are of particular interest for medical and military applications as Wearable Performance Monitors (WPMs) and sensors. Screen printed trace interconnects on highly compliant Thermoplastic Polyurethanes (TPU) provides a low cost, viable option. But these stretchability has high ramification on the reliability aspects of WPM construction. In this paper, we perform the reliability testing of two screen printed inks under repeated mechanical loads 'as-printed' and after exposure to temperature and humidity.","PeriodicalId":6726,"journal":{"name":"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)","volume":"42 1","pages":"768-776"},"PeriodicalIF":0.0000,"publicationDate":"2019-05-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 IEEE 69th Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2019.00122","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3
Abstract
Highly stretchable, bio-compatible interconnects are of particular interest for medical and military applications as Wearable Performance Monitors (WPMs) and sensors. Screen printed trace interconnects on highly compliant Thermoplastic Polyurethanes (TPU) provides a low cost, viable option. But these stretchability has high ramification on the reliability aspects of WPM construction. In this paper, we perform the reliability testing of two screen printed inks under repeated mechanical loads 'as-printed' and after exposure to temperature and humidity.