Shear fracture behavior of Sn3.0Ag0.5Cu solder joints on Cu pads with different solder volumes

2008 International Conference on Electronic Packaging Technology & High Density Packaging Pub Date : 2008-07-28 DOI:10.1109/ICEPT.2008.4607076

Yanhong Tian, Chunqing Wang, Shihua Yang, P. Lin, Le Liang

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引用次数: 4

Abstract

To meet the urgent demands of future electronic packages, the solder joints have to become increasingly miniaturized. Compared to the large solder joints, mechanics behavior for the samll solder joints is very different, resulting in a series of reliability issues. Therefore, it is very important to understand the mechanics behavior of the small solder joints. In this paper, the shear test of the as-reflowed and aged Sn-3.0Ag-0.5Cu solder joints on Cu pads with the diameters of 200 mum to 600 mum were conducted, and fracture behavior was observed using SEM. The results show that shear strength of the solder joint increases with the decreasing of the solder joints volumes. For the large volume solder joints, the fracture occurs close to the interface, and the solder joint shows strong brittleness. Whereas, for the small solder joints, the fracture occurs within the bulk solder, and the solder joint shows ductile property. The Ag3Sn and Cu6Sn5 intermetallic compounds (IMCs) at the interface region have a prominent effect on the shear property and the propagation of the fracture.

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不同焊料体积Cu焊盘上Sn3.0Ag0.5Cu焊点剪切断裂行为

为了满足未来电子封装的迫切需求，焊点必须越来越小型化。与大型焊点相比，小型焊点的力学行为有很大的不同，从而导致了一系列的可靠性问题。因此，了解小焊点的力学行为是非常重要的。本文在直径为200 ~ 600 μ m的Cu焊盘上对回流焊和时效后的Sn-3.0Ag-0.5Cu焊点进行了剪切试验，并通过扫描电镜观察了其断裂行为。结果表明:焊点的抗剪强度随焊点体积的减小而增大;对于体积较大的焊点，断裂发生在靠近界面处，焊点表现出较强的脆性。而对于小焊点，断裂发生在大块焊点内，焊点表现出延展性。界面区Ag3Sn和Cu6Sn5金属间化合物(IMCs)对剪切性能和断口扩展有显著影响。

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2008 International Conference on Electronic Packaging Technology & High Density Packaging

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