Hybrid modeling and analysis of different through-silicon-Via (TSV)-based 3D power distribution networks

Abstract

This paper reports on a novel partition and assembly approach that combines both the electromagnetic (EM) and analytical simulations to accurately model and analyze several through-silicon-via (TSV) based 3D power delivery networks, which are composed of various stacked-chips, interposer, and package substrate. With this method, we also analyzed RLC couplings between multiple voltage supply rails in 3D systems. The quantitatively examined power performance unveils 3D power delivery design implications, which is useful for 3D system design and fabrication.