A fully integrated circuit for MEMS vibrating gyroscope using standard 0.25um CMOS process

Sheng-Ren Chiu, Chung-Yang Sue, Lu-Pu Liao, Li-Tao Teng, Y. Hsu, Y. Su
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引用次数: 9

Abstract

This paper presents an all-in-one fully integrated circuit solution for a vibrating micro-electromechanical gyroscope system using standard 0.25um 1P5M low voltage CMOS process. The analog parts of the system include a trans-impedance amplifier (TIA) with adaptive gain control (AGC) for the resonator driving loop, a sigma-delta modulator with gain/offset trimming function for the Coriolis signal read-out and a modified all PMOS charge pump for the high DC voltage. The digital signal processing parts include a trimming/control logic circuit and an I2C interface. SOG-bulk micromachining and deep reactive ion etching (DRIE) are adopted to fabricate the gyroscope sensor element with high aspect-ratio sensing structure and high yield. The experimental results indicate that the noise floor achieves 0.051° / s/ √Hz and the scale factor is 7mV/ °/s of the proposed two chip MEMS gyroscope system.
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采用标准0.25um CMOS工艺的MEMS振动陀螺仪的完全集成电路
本文提出了一种采用标准0.25um 1P5M低压CMOS工艺的振动微机电陀螺仪系统的一体化全集成电路方案。该系统的模拟部分包括用于谐振器驱动回路的具有自适应增益控制(AGC)的反阻抗放大器(TIA),用于科里奥利信号读出的具有增益/失调调节功能的sigma-delta调制器,以及用于高直流电压的改进的全PMOS电荷泵。数字信号处理部分包括微调/控制逻辑电路和I2C接口。采用SOG-bulk微加工和深度反应离子刻蚀(deep reactive ion etching, DRIE)技术制备了具有高宽高比传感结构和高成品率的陀螺仪传感器元件。实验结果表明,所设计的双芯片MEMS陀螺仪系统的本底噪声达到0.051°/s /√Hz,比例因子为7mV/°/s。
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