对高温贮存后的短期失效进行详细的包装失效分析

Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) Pub Date : 2014-09-18 DOI:10.1109/IPFA.2014.6898174

Z. Oh, F. Foo, W. Qiu

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引用次数: 1

摘要

本文介绍了在150°C高温储存(HTS)试验后寻找一系列短失效的根本原因的失效分析方法。研究结果表明，锡对UBM的消耗和最终的分解使焊料扩散到模具电路中，导致大量的短故障。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Detailed package failure analysis on short failures after high temperature storage

This paper describes the failure analysis approach in search of the root cause behind a series of short failures after high-temperature storage (HTS) test at 150°C. Findings revealed that UBM consumption by tin and the eventual disintegration allowed solder diffusion into the die circuitries resulting in the massive short failures.

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Proceedings of the 21th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA)

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