基于薄膜绝缘体硅(TFSOI)技术的功率放大器

D. Ngo, W.M. Huang, J. Ford, D. Spooner
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引用次数: 5

摘要

便携式无线通信应用为半导体制造商提供了在大幅降低电源电压和功率的情况下运行的高性能电路提供了不懈的推动力。为了最终实现单芯片解决方案,这些电路的工艺技术必须支持无线电中的所有功能,从数字微控制器到射频下变频。文献反映了先前的工作,充分证明了薄膜绝缘体上硅(TFSOI)在低功耗数字基带电路(如微控制器cpu、SRAM、DRAM和alu)中的优势(Huang et al. 1997)。最近,在TFSOI中实现的低噪声放大器、混频器和vco等接收功能的结果已被报道(Harada et al. 1997;Dekker et al. 1997;Tseng et al. 1998)。缺乏功率放大器的成功演示一直是阻碍实现完整的TFSOI射频收发器的一个因素。本文报道了在TFSOI上使用n沟道射频MOSFET器件的功率放大器的首次演示结果。
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Power amplifiers on thin-film-silicon-on-insulator (TFSOI) technology
Portable wireless communication applications have provided a relentless driving force for semiconductor manufacturers to deliver high performance circuits operating with drastically reduced supply voltage and power. To ultimately enable a single chip solution, process technology for these circuits must support all functions within the radio, from digital microcontrollers to RF downconversion. The literature reflects previous work that soundly demonstrates the advantages of thin-film-silicon-on-insulator (TFSOI) in low power digital baseband circuits such as microcontroller CPUs, SRAM, DRAM and ALUs (Huang et al. 1997). More recently, results of receiver functions such as low noise amplifiers, mixers, and VCOs implemented in TFSOI have been reported (Harada et al. 1997; Dekker et al. 1997; Tseng et al. 1998). Lack of a successful demonstration of a power amplifier has been one element preventing implementation of a complete TFSOI RF transceiver. This paper reports the results of the first demonstration of power amplifiers on TFSOI, using n-channel RF MOSFET devices.
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