用于SRAM应用的新型Si/SiGe夹层多晶硅TFT

I. Manna, L. Jung, S. Banerjee
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引用次数: 0

摘要

在这项工作中,通过在tft的通道中引入薄多晶硅-锗合金层,首次提高了多晶硅tft的性能。多晶硅和SiGe之间价带的带隙不连续限制了通道中间的空穴远离高缺陷密度的多晶硅-氧化物界面。从工艺的角度来看,有一个夹层比沿着通道的整个深度有SiGe更好,因为众所周知SiGe上的氧化物质量很差。
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A novel Si/SiGe sandwich polysilicon TFT for SRAM applications
In this work, the performance of polysilicon TFTs has been improved for the first time by introduction of a thin polycrystalline silicon-germanium alloy layer sandwiched between thin polysilicon films in the channel of the TFTs. The bandgap discontinuity in the valence band between polysilicon and SiGe confines holes in the middle of the channel away from the high defect-density polysilicon-oxide interface. From the process point of view, it is better to have a sandwich layer than having SiGe along the entire depth of the channel because oxides on SiGe are known to be of bad quality.
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