{"title":"5G通信中基于硅的射频可靠性挑战","authors":"P. Colestock, P. Srinivasan, F. Guarín","doi":"10.1109/IRPS45951.2020.9129352","DOIUrl":null,"url":null,"abstract":"5G communication standards brings new promise and also new challenges. While the sub 6 GHz 5G market can leverage existing III-V front end PA solutions, the broad commercialization of CMOS based power generation at millimeter wave frequencies for 5G will chart new territory for reliable power generation. This paper hopes to lay the groundwork for charting the path to success for CMOS millimeter wave PA reliability from the lab to the fab to the field.","PeriodicalId":116002,"journal":{"name":"2020 IEEE International Reliability Physics Symposium (IRPS)","volume":"66 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"8","resultStr":"{\"title\":\"Silicon Based RF Reliability Challenges for 5G Communications\",\"authors\":\"P. Colestock, P. Srinivasan, F. Guarín\",\"doi\":\"10.1109/IRPS45951.2020.9129352\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"5G communication standards brings new promise and also new challenges. While the sub 6 GHz 5G market can leverage existing III-V front end PA solutions, the broad commercialization of CMOS based power generation at millimeter wave frequencies for 5G will chart new territory for reliable power generation. This paper hopes to lay the groundwork for charting the path to success for CMOS millimeter wave PA reliability from the lab to the fab to the field.\",\"PeriodicalId\":116002,\"journal\":{\"name\":\"2020 IEEE International Reliability Physics Symposium (IRPS)\",\"volume\":\"66 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2020-04-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"8\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2020 IEEE International Reliability Physics Symposium (IRPS)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IRPS45951.2020.9129352\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 IEEE International Reliability Physics Symposium (IRPS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IRPS45951.2020.9129352","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Silicon Based RF Reliability Challenges for 5G Communications
5G communication standards brings new promise and also new challenges. While the sub 6 GHz 5G market can leverage existing III-V front end PA solutions, the broad commercialization of CMOS based power generation at millimeter wave frequencies for 5G will chart new territory for reliable power generation. This paper hopes to lay the groundwork for charting the path to success for CMOS millimeter wave PA reliability from the lab to the fab to the field.
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