{"title":"交联环氧树脂中尺度方法的热机械性能评定。初步结果","authors":"S. Tesarski, A. Wymyslowski, O. Holck","doi":"10.1109/ESIME.2011.5765833","DOIUrl":null,"url":null,"abstract":"Usage of polymers materials in microelectronics and especially in packing is nowadays common. Polymer materials are used for example in case of encapsulation, underfills for flip chip, moulding compound, electrically or thermally conductive adhesive, flexible electronics, materials for Printed Circuits Board (PCB), etc.","PeriodicalId":115489,"journal":{"name":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","volume":"26 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2011-04-18","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":"{\"title\":\"Assessment of thermo mechanical properties of crosslinked epoxy mesoscale approach — Preliminary results\",\"authors\":\"S. Tesarski, A. Wymyslowski, O. Holck\",\"doi\":\"10.1109/ESIME.2011.5765833\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Usage of polymers materials in microelectronics and especially in packing is nowadays common. Polymer materials are used for example in case of encapsulation, underfills for flip chip, moulding compound, electrically or thermally conductive adhesive, flexible electronics, materials for Printed Circuits Board (PCB), etc.\",\"PeriodicalId\":115489,\"journal\":{\"name\":\"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems\",\"volume\":\"26 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2011-04-18\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"6\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ESIME.2011.5765833\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ESIME.2011.5765833","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Assessment of thermo mechanical properties of crosslinked epoxy mesoscale approach — Preliminary results
Usage of polymers materials in microelectronics and especially in packing is nowadays common. Polymer materials are used for example in case of encapsulation, underfills for flip chip, moulding compound, electrically or thermally conductive adhesive, flexible electronics, materials for Printed Circuits Board (PCB), etc.
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