B. Illés, A. Skwarek, O. Krammer, T. Hurtony, Dániel Straubinger, J. Ratajczak, G. Harsányi, K. Witek
{"title":"纳米复合SACX0307-(ZnO, TiO2)钎料的性能","authors":"B. Illés, A. Skwarek, O. Krammer, T. Hurtony, Dániel Straubinger, J. Ratajczak, G. Harsányi, K. Witek","doi":"10.23919/empc53418.2021.9585015","DOIUrl":null,"url":null,"abstract":"In the present study, SACX0307-ZnO and SACX0307-TiO2 nano-composite solder pastes were fabricated. The ceramic reinforcements were used in 1wt% and with different primary particle sizes between 50-200nm. The soldering properties and microstructure of the solder joints were investigated. The nano-particles were mixed into the solder paste by standard ball milling process. Reflow soldering technology has been applied to prepare solder joints and spreading tests from the different solder alloys. The solder joints were evaluated by shear test, and cross-sections were prepared to investigate the metallographic properties by Scanning Electron Microscopy (SEM). The different ceramic nano-particles had different effects on the solderability of solder alloys. Best results were observed in the case of TiO2 nano-particles with improved wetting and mechanical strength. The microstructural investigations showed considerable grain refinement and the modified grain boundary/interfacial properties, which could cause the increase of the mechanical parameters.","PeriodicalId":348887,"journal":{"name":"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)","volume":"9 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-09-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Properties of nano-composite SACX0307-(ZnO, TiO2) solders\",\"authors\":\"B. Illés, A. Skwarek, O. Krammer, T. Hurtony, Dániel Straubinger, J. Ratajczak, G. Harsányi, K. Witek\",\"doi\":\"10.23919/empc53418.2021.9585015\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In the present study, SACX0307-ZnO and SACX0307-TiO2 nano-composite solder pastes were fabricated. The ceramic reinforcements were used in 1wt% and with different primary particle sizes between 50-200nm. The soldering properties and microstructure of the solder joints were investigated. The nano-particles were mixed into the solder paste by standard ball milling process. Reflow soldering technology has been applied to prepare solder joints and spreading tests from the different solder alloys. The solder joints were evaluated by shear test, and cross-sections were prepared to investigate the metallographic properties by Scanning Electron Microscopy (SEM). The different ceramic nano-particles had different effects on the solderability of solder alloys. Best results were observed in the case of TiO2 nano-particles with improved wetting and mechanical strength. The microstructural investigations showed considerable grain refinement and the modified grain boundary/interfacial properties, which could cause the increase of the mechanical parameters.\",\"PeriodicalId\":348887,\"journal\":{\"name\":\"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)\",\"volume\":\"9 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-09-13\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/empc53418.2021.9585015\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/empc53418.2021.9585015","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Properties of nano-composite SACX0307-(ZnO, TiO2) solders
In the present study, SACX0307-ZnO and SACX0307-TiO2 nano-composite solder pastes were fabricated. The ceramic reinforcements were used in 1wt% and with different primary particle sizes between 50-200nm. The soldering properties and microstructure of the solder joints were investigated. The nano-particles were mixed into the solder paste by standard ball milling process. Reflow soldering technology has been applied to prepare solder joints and spreading tests from the different solder alloys. The solder joints were evaluated by shear test, and cross-sections were prepared to investigate the metallographic properties by Scanning Electron Microscopy (SEM). The different ceramic nano-particles had different effects on the solderability of solder alloys. Best results were observed in the case of TiO2 nano-particles with improved wetting and mechanical strength. The microstructural investigations showed considerable grain refinement and the modified grain boundary/interfacial properties, which could cause the increase of the mechanical parameters.
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